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参数资料
| 型号： | WE128K32P-125H1I |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 128K X 32 EEPROM 5V MODULE, 125 ns, CPGA66 |
| 封装： | 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 5/14页 |
| 文件大小： | 496K |
| 代理商： | WE128K32P-125H1I |
13
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WE128K32-XXX
March 2008
Rev. 12
White Electronic Designs Corp. reserves the right to change products or specications without notice.
I/O8
I/O9
I/O10
A14
A16
A11
A0
NC
I/O0
I/O1
I/O2
WE2#
CS2#
GND
I/O11
A10
A9
A15
VCC
CS1#
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
NC
WE1#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4#
WE4#
I/O27
A4
A5
WE3#
CS3#
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2T = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 509)
ACCESS TIME (ns)*
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Conguration for HIP package
ORGANIZATION 128K
x 32
User Congurable as 256K x 16 or 512K x 8
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W E 128K32 X - XXX X X X
Pin Description
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
FIGURE 12 – ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
Block Diagram
128K x 8
8
I/O0-7
WE1# CS1#WE2# CS2#WE3# CS3#WE4# CS4#
128K x 8
8
I/O8-15
128K x 8
8
I/O16-23
128K x 8
8
I/O24-31
A0-16
OE#
Top View
* 120 available in commercial and industrial temperature only.
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