参数资料
型号: WS512K32N-120HQ
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66
封装: 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 8/8页
文件大小: 182K
代理商: WS512K32N-120HQ
8
White Electronic Designs Corporation Phoenix AZ (602) 437-1520
WS512K32-XXX
White Electronic Designs
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 401)
G2T1 = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP
(Package 509)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 21 and 39 in HIP for Upgrades
ORGANIZATION, 512Kx32
User configurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
DEVICE TYPE
SPEED
PACKAGE
SMD NO.
512K x 32 SRAM Module
120ns
66 pin HIP (H)1
5962-94611 01HUX
512K x 32 SRAM Module
100ns
66 pin HIP (H)1
5962-94611 02HUX
512K x 32 SRAM Module
85ns
66 pin HIP (H)1
5962-94611 03HUX
512K x 32 SRAM Module
70ns
66 pin HIP (H)1
5962-94611 04HUX
512K x 32 SRAM Module
120ns
68 lead CQFP (G2T)1
5962-94611 01HMX
512K x 32 SRAM Module
100ns
68 lead CQFP (G2T)1
5962-94611 02HMX
512K x 32 SRAM Module
85ns
68 lead CQFP (G2T)1
5962-94611 03HMX
512K x 32 SRAM Module
70ns
68 lead CQFP (G2T)1
5962-94611 04HMX
ORDERING INFORMATION
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended for New Designs.
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相关代理商/技术参数
参数描述
WS512K32N-17H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-17H1CA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-17H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-17H1IA 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-17H1M 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 17NS, NO CONNECT, 66 PGA 1.075" S - Bulk