参数资料
型号: XA2R
元件分类: 功率/信号继电器
英文描述: POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT
文件页数: 10/16页
文件大小: 1015K
代理商: XA2R
NOTES
SERIES X
[1] Standard Intermediate current test applicable.
[2] Inductive load life, 20,000 cycles.
[3] Low level endurance test: contact load of 10 to 50 millivolt, 10 to 50 microamp, 100 Ohm max. contact
resistance.
[4] Refer to MIL-R-83536 for details.
[5] "N" "R" & "V" coils have back EMF suppression to 42 volts maximum.
[6] 500 Vrms with silicone rubber gasket compressed, 250 Vrms all other conditions.
[7] Applicable to Type "N", "R" & "V" coils only.
8. Reference M83536/1,2,3,4.
9. Relay will not operate, but will not be damaged by application of reverse polarity on coil.
NUMBERING SYSTEM
X
A
1
A
Basic series designation__________________________|
|
1-Mounting Style (A,D,E,G,J)__________________________|
|
2-Terminal Types (1,2,4,7)________________________________|
|
3-Coil Voltage see coil characteristics (A,B,C,M,N,R & V)_____|
MOUNTING STYLES
Date of issue: 9/07
- 55 -
Page 3 of 4
2 RELAY HEIGHT MAY BE INCREASED .100 INCH FOR "N" SUPPRESSED COILS
MOUNTING STYLE A
2
.410 MAX
.640 MAX
.810
MAX
.224 DIA
MOUNTING STYLE G
RELAY HEIGHT MAY BE INCREASED .100 INCH FOR "N" SUPPRESSED COILS
2
.375
.500
.810
MAX
.640 MAX 2
.032
2 PLACES
#4-40 UNC-2A
STUD
MAX
.410
1.280
1.078
1.062
MOUNTING STYLE D
RELAY HEIGHT MAY BE INCREASED .100 INCH FOR "N" SUPPRESSED COILS
2
MAX
TYP
.133
.312
.156
MAX
.810
.025
TYP
MAX
.410
.141
.640 MAX 2
MOUNTING STYLE E
RELAY HEIGHT MAY BE INCREASED .100 INCH FOR "N" SUPPRESSED COILS
ON THIS MOUNTING STYLE.
SILICONE GASKET NOT PROVIDED
SYSTEM, MT-3000-003 AND
FOR USE WITH TRACK MOUNT
.110
.005
+
2
SM-1000-003
NOTES:
-
+
.080
.005
-
.055
.005
-
+
.156
.005
+
-
2 PLACES
.055
.005
+
-
.640 MAX
MAX
.410
MAX
.810
2
2 RELAY HEIGHT MAY BE INCREASED .100 INCH FOR "N" SUPPRESSED COILS
MOUNTING STYLE J
2
.410 MAX
.810
.025
1.280 MAX
.312
.133
.141
1.062
1.078
.320
.640
MAX
FULL R
4 PLACES
MAX
相关PDF资料
PDF描述
XA2M POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.03A (COIL), 48VDC (COIL), 1440mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT
XA2B POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT
XA2A POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.056A (COIL), 28VDC (COIL), 1568mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT
XA1V POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.3A (COIL), 6VDC (COIL), 1800mW (COIL), 5A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT
XA1R POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT
相关代理商/技术参数
参数描述
XA2S100E-6FT256Q 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S100E-6TQ144I 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S100E-6TQ144Q 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S150E-6FT256I 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S150E-6FT256Q 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)