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参数资料
| 型号： | XA2R |
| 元件分类： | 功率/信号继电器 |
| 英文描述： | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT |
| 文件页数： | 4/16页 |
| 文件大小： | 1015K |
| 代理商： | XA2R |
The diode + resistor network
It eliminates the inconvenience of the resistor alone, explained above, and it limits the action of a single diode. It is now
preferred to used the diode + zener network.
The diode + zener network
Like the resistor, the zener allows a faster decurrent decay. In addition it introduces a threshold level for current conduction
which avoids the recycling of energy released during contact movement.
The lower curve on the opposite record demonstrates those characteristics. Voltage limitation occurs at 42V. The two voltages
spikes generated by internal movement are at lower levels than zener conduction. As a result, no current is recycled in the
coil.
The opening time phases are as follows:
- time to start the movement 2.6ms
- total motion time 2.4ms
- transfer time 1.4ms
The release time is slightly increased. The contacts' opening speed remains unchanged.
Date of issue: 6/00
- 11 -
Page 4 of 4
相关PDF资料 |
PDF描述 |
|---|---|
| XA2M | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.03A (COIL), 48VDC (COIL), 1440mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT |
| XA2B | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT |
| XA2A | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.056A (COIL), 28VDC (COIL), 1568mW (COIL), 5A (CONTACT), 28VDC (CONTACT), PANEL MOUNT |
| XA1V | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.3A (COIL), 6VDC (COIL), 1800mW (COIL), 5A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
| XA1R | POWER/SIGNAL RELAY, DPDT, MOMENTARY, 0.096A (COIL), 12VDC (COIL), 1152mW (COIL), 5A (CONTACT), 28VDC (CONTACT), SOCKET MOUNT |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XA2S100E-6FT256Q | 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA2S100E-6TQ144I | 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA2S100E-6TQ144Q | 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA2S150E-6FT256I | 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA2S150E-6FT256Q | 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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