参数资料
| 型号： | XC17256EPDG8C |
| 厂商： | Xilinx Inc |
| 文件页数： | 3/15页 |
| 文件大小： | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 产品变化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 标准包装： | 50 |
| 可编程类型： | OTP |
| 存储容量： | 256Kb |
| 电源电压： | 4.75 V ~ 5.25 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
| 其它名称： | 122-1576-5 |
Device Package User Guide
11
UG112 (v3.7) September 5, 2012
Specifications and Definitions
R
Daisy Chain Samples XCDAISY-XXXXX (where XXXXX is the package code of interest)
Use this part type to perform board-based evaluations (such as vibrations and temperature
cycles) to see how well the solder balls withstand these mechanical conditions. For Xilinx
daisy chain parts (XCDAISY-XXXXX), a specific ball assignment chain is available. If you
do not have a board already made, you can use our default chain. You can purchase these
parts from Xilinx through standard sales outlets. Xilinx does not support unique chains
because these parts do not have the volume to justify the development effort.
Example:
To order a FG676 package in a daisy-chained configuration, the part number would be
XCDAISY-FG676.
Specifications and Definitions
Inches vs. Millimeters
The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in
inches. The lead spacing is specified as 25 mils, 50 mils, or 100 mils (0.025 in., 0.050 in. or
0.100 in.).
The JEDEC standards for PQFP, HQFP, TQFP, VQFP, CSP, and BGA packages define
package dimensions in millimeters. The lead frame packages have lead spacings of
0.5 mm, 0.65 mm, or 0.8 mm. The CSP and BGA packages have ball pitches of 0.5 mm,
0.8 mm, 1.00 mm, or 1.27 mm.
Because of the potential for measurement discrepancies, this Data Book provides
measurements in the controlling standard only, either inches or millimeters.
Pressure Handling Capacity
For mounted BGA packages, including flip chips, a direct compressive (non-varying) force
applied normally to the lid or top of package with a tool head that coincides with the lid (or
is slightly bigger) will not induce mechanical damage to the device including external
balls, provided the force is not over 5.0 grams per external ball, and the device and board
are supported to prevent any flexing or bowing.
These components are tested in sockets with loads in the 5 to 10 gm/ball range for short
durations. Analysis using a 10g/ball (e.g., 10 kg for FF1148) showed little impact on short-
term but some creep over time. 20 gm/ball and 45 gm/ball loads at 85
°C over a six week
period has shown the beginning of bridging of some outer balls; these were static load
tests. The component can survive forces greater than the 5 gm limit while in short-term
situations. However, sustained higher loads should be avoided (particularly if they are
overlaid with thermal or power cycle loads). Within the recommended limits, circuit board
needs to be properly supported to prevent any flexing resulting from force application.
Any flexing or bowing resulting from such a force can likely damage the package-to-board
connections. Besides the damage that can occur from bending, the only major concern is
long-term creep and bulging of the solder balls in compression to cause bridging. For the
life of a part, staying below the recommended limit will ensure against that remote
possibility.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17256L-PC20C | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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