参数资料
| 型号： | XC17256EPDG8C |
| 厂商： | Xilinx Inc |
| 文件页数： | 7/15页 |
| 文件大小： | 0K |
| 描述： | IC PROM SERIAL 256K 8-DIP |
| 产品变化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 标准包装： | 50 |
| 可编程类型： | OTP |
| 存储容量： | 256Kb |
| 电源电压： | 4.75 V ~ 5.25 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 8-PDIP |
| 包装： | 管件 |
| 其它名称： | 122-1576-5 |
Device Package User Guide
15
UG112 (v3.7) September 5, 2012
Part Marking
R
Small Form Factor Packages
A second template is used on smaller packages that do not have enough room for six lines
of marking. This marking is used mainly for PROMs, and can be found on some medium-
size packages as well.
Line 1
X-Ref Target - Figure 1-1
Figure 1-1:
Top Marking (for Large Device Packages)
FFG1136xxxXXXX
1C
DxxxxxxxA
XC5VLX50T
- ES
Device Type
Package
Speed Grade
Operating Range
Lot Code
Engineering Sample
UG112_C1_01_040709
TM
R
Date Code
Table 1-2:
Xilinx Device Marking Definition—Example
Item
Description
Corporate Logo
Xilinx logo, Xilinx name with trademark, and trademark-registered status.
Family Brand Logo
Product family name with trademark and trademark-registered status. This line is optional and
could appear blank.
1st Line
Device type.
2nd Line
Package type and pin count, circuit design revision, the location code for the wafer fab, the
geometry code, and date code.
A G in the third letter of a package type indicates a Pb-free RoHS compliant package. For more
details on Xilinx Pb-Free and RoHS Compliant Products, see:
3rd Line
Ten alphanumeric characters for assembly, lot, and step information. The last digit is usually an
A or an M if a stepping version does not exist.
4th Line
Device speed grade and temperature range. If a grade is not marked on the package, the
product is considered commercial grade.
Other variations for the 4th line:
1C-xxxx
The xxxx indicates the SCD for the device. An SCD is a special ordering code
that is not always marked in the device top mark.
1C-ES
The ES indicates an Engineering Sample.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC17256EVO8C | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17256EVO8I | 功能描述:IC SERIAL CFG PROM 256K 8-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17256L-PC20C | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
| XC17256L-PC20I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
| XC17256LPD8C | 制造商:Xilinx 功能描述: |
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