参数资料
型号: XC18V04VQG44C
厂商: Xilinx Inc
文件页数: 18/24页
文件大小: 0K
描述: IC PROM REPROGR 4MB 44-VQFP
标准包装: 160
可编程类型: 系统内可编程
存储容量: 4Mb
电源电压: 3 V ~ 3.6 V
工作温度: 0°C ~ 70°C
封装/外壳: 44-TQFP
供应商设备封装: 44-VQFP(10x10)
包装: 托盘
XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v5.2) January 11, 2008
Product Specification
3
R
CEO
12
DATA OUT
Chip Enable Output (CEO) is connected to the
CE input of the next PROM in the chain. This
output is Low when CE is Low and OE/RESET
input is High, AND the internal address counter
has been incremented beyond its Terminal
Count (TC) value. CEO returns to High when
OE/RESET goes Low or CE goes High.
21
27
13
11
OUTPUT
ENABLE
GND
GND is the ground connection.
6, 18, 28 & 41
3, 12, 24 &
34
11
TMS
MODE
SELECT
The state of TMS on the rising edge of TCK
determines the state transitions at the Test
Access Port (TAP) controller. TMS has an
internal 50 k
Ω resistive pull-up to provide a
logic 1 to the device if the pin is not driven.
511
5
TCK
CLOCK
This pin is the JTAG test clock. It sequences
the TAP controller and all the JTAG test and
programming electronics.
713
6
TDI
DATA IN
This pin is the serial input to all JTAG
instruction and data registers. TDI has an
internal 50 k
Ω resistive pull-up to provide a
logic 1 to the device if the pin is not driven.
39
4
TDO
DATA OUT
This pin is the serial output for all JTAG
instruction and data registers. TDO has an
internal 50 k
Ω resistive pull-up to provide a
logic 1 to the system if the pin is not driven.
31
37
17
VCCINT
Positive 3.3V supply voltage for internal logic.
17, 35 & 38(3)
23, 41 &
44(3)
18 & 20(3)
VCCO
Positive 3.3V or 2.5V supply voltage connected
to the input buffers(2) and output voltage
drivers.
8, 16, 26 & 36 14, 22, 32 &
42
19
NC
No connects.
1, 2, 4,
11, 12, 20, 22,
23, 24, 30, 32,
33, 34, 37, 39,
44
1, 6, 7, 8,
10, 17, 18,
26, 28, 29,
30, 36, 38,
39, 40, 43
Notes:
1.
By default, pin 7 is the D4 pin in the 20-pin packages. However, CF
→D4 programming option can be set to override the default and route
the CF function to pin 7 in the Serial mode.
2.
For devices with IDCODES 0502x093h, the input buffers are supplied by VCCINT.
3.
For devices with IDCODES 0503x093h, the following VCCINT pins are no-connects: pin 38 in 44-pin VQFP package, pin 44 in 44-pin PLCC
package, and pin 20 in 20-pin SOIC and 20-pin PLCC packages.
Table 1: Pin Names and Descriptions (Cont’d)
Pin
Name
Boundary-
Scan Order
Function
Pin Description
44-pin VQFP
44-pin
PLCC
20-pin
SOIC &
PLCC
相关PDF资料
PDF描述
T97R158K004CAB CAP TANT 1500UF 4V 10% 3024
TNY276PG IC OFFLINE SWIT OVP OTP HV 8DIP
RSM43DRUS CONN EDGECARD 86POS DIP .156 SLD
RMM43DRUS CONN EDGECARD 86POS DIP .156 SLD
GRM21AR72E222KW01D CAP CER 2200PF 250V 10% X7R 0805
相关代理商/技术参数
参数描述
XC18V04VQG44C4118 制造商:Xilinx 功能描述:
XC18V256PC20C 功能描述:IC PROM SRL CONFIG 256K 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件
XC18V256PC20I 功能描述:IC PROM SER I-TEMP 3.3V 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件
XC18V256SO20C 功能描述:IC PROM SRL CONFIG 256K 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件
XC18V256SO20I 功能描述:IC PROM SER I-TEMP 3.3V 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-TSOP 包装:管件