- 您现在的位置：买卖IC网 > PDF目录19901 > XC18V04VQG44C (Xilinx Inc)IC PROM REPROGR 4MB 44-VQFP PDF资料下载
参数资料
| 型号： | XC18V04VQG44C |
| 厂商： | Xilinx Inc |
| 文件页数： | 6/24页 |
| 文件大小： | 0K |
| 描述： | IC PROM REPROGR 4MB 44-VQFP |
| 标准包装： | 160 |
| 可编程类型： | 系统内可编程 |
| 存储容量： | 4Mb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 44-TQFP |
| 供应商设备封装： | 44-VQFP（10x10） |
| 包装： | 托盘 |
XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v5.2) January 11, 2008
Product Specification
14
R
Reset and Power-On Reset Activation
At power up, the device requires the VCCINT power supply to
rise monotonically to the nominal operating voltage within
the specified VCCINT rise time. If the power supply cannot
meet this requirement, then the device might not perform
power-on reset properly. During the power-up sequence,
OE/RESET is held Low by the PROM.
Once the required supplies have reached their respective
POR (Power On Reset) thresholds, the OE/RESET release
is delayed (TOER minimum) to allow more margin for the
power supplies to stabilize before initiating configuration.
The OE/RESET pin is connected to an external pull-up
resistor and also to the target FPGA's INIT_B pin. For
systems utilizing slow-rising power supplies, an additional
power monitoring circuit can be used to delay the target
configuration until the system power reaches minimum
operating voltages by holding the OE/RESET pin Low.
When OE/RESET is released, the FPGA’s INIT_B pin is
pulled High, allowing the FPGA's configuration sequence to
begin. If the power drops below the power-down threshold
(VCCPD), the PROM resets and OE/RESET is again held
Low until the after the POR threshold is reached.
OE/RESET polarity is not programmable. These power-up
requirements are shown graphically in Figure 9.
For a fully powered Platform Flash PROM, a reset occurs
whenever OE/RESET is asserted (Low) or CE is deasserted
(High). The address counter is reset, CEO is driven High, and
the remaining outputs are placed in a high-Z state.
Standby Mode
The PROM enters a low-power standby mode whenever CE
is asserted High. The address is reset. The output remains
in a high-Z state regardless of the state of the OE input.
JTAG pins TMS, TDI and TDO can be in a high-Z state or
High. See Table 7.
When using the FPGA DONE signal to drive the PROM CE
pin High to reduce standby power after configuration, an
external pull-up resistor should be used. Typically a 330
Ω
pull-up resistor is used, but refer to the appropriate FPGA
data sheet for the recommended DONE pin pull-up value. If
the DONE circuit is connected to an LED to indicate FPGA
configuration is complete, and also connected to the PROM
CE pin to enable low-power standby mode, then an external
buffer should be used to drive the LED circuit to ensure valid
transitions on the PROMs CE pin. If low-power standby
mode is not required for the PROM, then the CE pin should
be connected to ground.
5V Tolerant I/Os
The I/Os on each re-programmable PROM are fully 5V tolerant
even through the core power supply is 3.3V. This allows 5V
CMOS signals to connect directly to the PROM inputs without
damage. In addition, the 3.3V VCCINT power supply can be
applied before or after 5V signals are applied to the I/Os. In
mixed 5V/3.3V/2.5V systems, the user pins, the core power
supply (VCCINT), and the output power supply (VCCO) can have
power applied in any order. This makes the PROM devices
immune to power supply sequencing issues.
X-Ref Target - Figure 9
Figure 9: VCCINT Power-Up Requirements
TOER
VCCINT
VCCPOR
VCCPD
200 s ramp
50 ms ramp
TOER
TRST
TIME (ms)
A slow-ramping VCCINT supply may still
be below the minimum operating
voltage when OE/RESET is released.
In this case, the configuration
sequence must be delayed until both
VCCINT and VCCO have reached their
recommended operating conditions.
Recommended Operating Range
Delay or Restart
Configuration
ds026_20_032504
相关PDF资料 |
PDF描述 |
|---|---|
| T97R158K004CAB | CAP TANT 1500UF 4V 10% 3024 |
| TNY276PG | IC OFFLINE SWIT OVP OTP HV 8DIP |
| RSM43DRUS | CONN EDGECARD 86POS DIP .156 SLD |
| RMM43DRUS | CONN EDGECARD 86POS DIP .156 SLD |
| GRM21AR72E222KW01D | CAP CER 2200PF 250V 10% X7R 0805 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC18V04VQG44C4118 | 制造商:Xilinx 功能描述: |
| XC18V256PC20C | 功能描述:IC PROM SRL CONFIG 256K 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC18V256PC20I | 功能描述:IC PROM SER I-TEMP 3.3V 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC18V256SO20C | 功能描述:IC PROM SRL CONFIG 256K 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC18V256SO20I | 功能描述:IC PROM SER I-TEMP 3.3V 20-SOIC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
发布紧急采购，3分钟左右您将得到回复。