参数资料
型号: XC3S250E-4CPG132I
厂商: Xilinx Inc
文件页数: 112/227页
文件大小: 0K
描述: IC FPGA SPARTAN-3E 250K 132CSBGA
标准包装: 360
系列: Spartan®-3E
LAB/CLB数: 612
逻辑元件/单元数: 5508
RAM 位总计: 221184
输入/输出数: 92
门数: 250000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 132-TFBGA,CSPBGA
供应商设备封装: 132-CSPBGA(8x8)
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DS312 (v4.1) July 19, 2013
Product Specification
2
Copyright 2005–2013 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx
in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners.
Introduction
The Spartan-3E family of Field-Programmable Gate
Arrays (FPGAs) is specifically designed to meet the needs
of high volume, cost-sensitive consumer electronic
applications. The five-member family offers densities
ranging from 100,000 to 1.6 million system gates, as shown
The Spartan-3E family builds on the success of the earlier
Spartan-3 family by increasing the amount of logic per I/O,
significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of
configuration. These Spartan-3E FPGA enhancements,
combined with advanced 90 nm process technology, deliver
more functionality and bandwidth per dollar than was
previously possible, setting new standards in the
programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home
networking, display/projection, and digital television
equipment.
The Spartan-3E family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
Features
Very low cost, high-performance logic solution for
high-volume, consumer-oriented applications
Proven advanced 90-nanometer process technology
Multi-voltage, multi-standard SelectIO interface pins
Up to 376 I/O pins or 156 differential signal pairs
LVCMOS, LVTTL, HSTL, and SSTL single-ended signal
standards
3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
622+ Mb/s data transfer rate per I/O
True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL
differential I/O
Enhanced Double Data Rate (DDR) support
DDR SDRAM support up to 333 Mb/s
Abundant, flexible logic resources
Densities up to 33,192 logic cells, including optional shift
register or distributed RAM support
Efficient wide multiplexers, wide logic
Fast look-ahead carry logic
Enhanced 18 x 18 multipliers with optional pipeline
IEEE 1149.1/1532 JTAG programming/debug port
Hierarchical SelectRAM memory architecture
Up to 648 Kbits of fast block RAM
Up to 231 Kbits of efficient distributed RAM
Up to eight Digital Clock Managers (DCMs)
Clock skew elimination (delay locked loop)
Frequency synthesis, multiplication, division
High-resolution phase shifting
Wide frequency range (5 MHz to over 300 MHz)
Eight global clocks plus eight additional clocks per each half
of device, plus abundant low-skew routing
Configuration interface to industry-standard PROMs
Low-cost, space-saving SPI serial Flash PROM
x8 or x8/x16 parallel NOR Flash PROM
Low-cost Xilinx Platform Flash with JTAG
Complete Xilinx ISE and WebPACK software
embedded processor cores
Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in
some devices)
Low-cost QFP and BGA packaging options
Common footprints support easy density migration
Pb-free packaging options
8
Spartan-3E FPGA Family:
Introduction and Ordering Information
DS312 (v4.1) July 19, 2013
Product Specification
Table 1: Summary of Spartan-3E FPGA Attributes
Device
System
Gates
Equivalent
Logic Cells
CLB Array
(One CLB = Four Slices)
Distributed
RAM bits(1)
Block
RAM
bits(1)
Dedicated
Multipliers
DCMs
Maximum
User I/O
Maximum
Differential
I/O Pairs
Rows Columns
Total
CLBs
Total
Slices
XC3S100E
100K
2,160
22
16
240
960
15K
72K
4
2
108
40
XC3S250E
250K
5,508
34
26
612
2,448
38K
216K
12
4
172
68
XC3S500E
500K
10,476
46
34
1,164
4,656
73K
360K
20
4
232
92
XC3S1200E
1200K
19,512
60
46
2,168
8,672
136K
504K
28
8
304
124
XC3S1600E
1600K
33,192
76
58
3,688
14,752
231K
648K
36
8
376
156
Notes:
1.
By convention, one Kb is equivalent to 1,024 bits.
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