参数资料
型号: XC3SD3400A-4CSG484LI
厂商: Xilinx Inc
文件页数: 63/101页
文件大小: 0K
描述: IC FPGA SPARTAN 3 DSP 484CSGBGA
标准包装: 84
系列: Spartan®-3A DSP
LAB/CLB数: 5968
逻辑元件/单元数: 53712
RAM 位总计: 2322432
输入/输出数: 309
门数: 3400000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 484-FBGA,CSPBGA
供应商设备封装: 484-CSPBGA
其它名称: 122-1723
XC3SD3400A-4CSG484LI-ND
Spartan-3A DSP FPGA Family: Pinout Descriptions
DS610 (v3.0) October 4, 2010
Product Specification
64
Electronic versions of the package pinout tables and foot- prints are available for download from the Xilinx website. Using
a spreadsheet program, the data can be sorted and reformatted according to any specific needs. Similarly, the ASCII-text file
is easily parsed by most scripting programs. www.xilinx.com/support/documentation/data_sheets/s3a_pin.zip
Package Overview
Table 60 shows the two low-cost, space-saving production package styles for the Spartan-3A DSP family.
Each package style is available as a standard and an environmentally friendly lead-free (Pb-free) option. The Pb-free
packages include an extra ‘G’ in the package style name. For example, the standard “CS484” package becomes “CSG484”
when ordered as the Pb-free option. The mechanical dimensions of the standard and Pb-free packages are similar, as
shown in the mechanical drawings provided in Table 61.
For additional package information, see UG112: Device Package User Guide.
Mechanical Drawings
Detailed mechanical drawings for each package type are available from the Xilinx web site at the specified location in
Material Declaration Data Sheets (MDDS) are also available on the Xilinx web site for each package.
Table 60: Spartan-3A DSP Family Package Options
Package
Leads
Type
Maximum
I/O
Lead Pitch
(mm)
Footprint
Area (mm)
Height
(mm)
Mass(1)
(g)
CS484 / CSG484
484
Chip-Scale Ball Grid Array (CS)
309
0.8
19 x 19
1.80
1.4
FG676 / FGG676
676
Fine-pitch Ball Grid Array (FBGA)
519
1.0
27 x 27
2.60
3.4
Notes:
1.
Package mass is
±10%.
Table 61: Xilinx Package Documentation
Package
Drawing
MDDS
CS484
CSG484
FG676
FGG676
相关PDF资料
PDF描述
FAN2514S33X IC REG LDO 3.3V .2A SOT23-5
XC6SLX75-2CSG484C IC FPGA SPARTAN 6 74K 484CSGBGA
FAN2514S28X IC REG LDO 2.8V .2A SOT23-5
XC3S1400AN-5FGG676C IC FPGA SPARTAN -3N1400K 676FBGA
FAN2514S285X IC REG LDO 2.85V .2A SOT23-5
相关代理商/技术参数
参数描述
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XC3SD3400A-4FG676CES 制造商:Xilinx 功能描述:
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XC3SD3400A-4FGG676I 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3A DSP 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5