参数资料
| 型号： | XCS20-3PQ208C |
| 厂商： | Xilinx Inc |
| 文件页数： | 60/83页 |
| 文件大小： | 0K |
| 描述： | IC FPGA 5V C-TEMP 208-PQFP |
| 产品变化通告： | Spartan,Virtex FPGA/SCD Discontinuation 18/Oct/2010 |
| 标准包装： | 24 |
| 系列： | Spartan® |
| LAB/CLB数： | 400 |
| 逻辑元件/单元数： | 950 |
| RAM 位总计： | 12800 |
| 输入/输出数： | 160 |
| 门数： | 20000 |
| 电源电压： | 4.75 V ~ 5.25 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
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Spartan and Spartan-XL FPGA Families Data Sheet
DS060 (v2.0) March 1, 2013
63
Product Specification
R
Product Obsolete/Under Obsolescence
PWRDWN
II
PWRDWN is an active Low input that forces the FPGA into the Power Down state
and reduces power consumption. When PWRDWN is Low, the FPGA disables all
I/O and initializes all flip-flops. All inputs are interpreted as Low independent of
their actual level. VCC must be maintained, and the configuration data is
maintained. PWRDWN halts configuration if asserted before or during
configuration, and re-starts configuration when removed. When PWRDWN returns
High, the FPGA becomes operational by first enabling the inputs and flip-flops and
then enabling the outputs. PWRDWN has a default internal pull-up resistor.
User I/O Pins That Can Have Special Functions
TDO
O
If boundary scan is used, this pin is the Test Data Output. If boundary scan is not
used, this pin is a 3-state output without a register, after configuration is
completed.
To use this pin, place the library component TDO instead of the usual pad symbol.
An output buffer must still be used.
TDI, TCK,
TMS
II/O
or I
(JTAG)
If boundary scan is used, these pins are Test Data In, Test Clock, and Test Mode
Select inputs respectively. They come directly from the pads, bypassing the IOBs.
These pins can also be used as inputs to the CLB logic after configuration is
completed.
If the BSCAN symbol is not placed in the design, all boundary scan functions are
inhibited once configuration is completed, and these pins become
user-programmable I/O. In this case, they must be called out by special library
elements. To use these pins, place the library components TDI, TCK, and TMS
instead of the usual pad symbols. Input or output buffers must still be used.
HDC
O
I/O
High During Configuration (HDC) is driven High until the I/O go active. It is
available as a control output indicating that configuration is not yet completed.
After configuration, HDC is a user-programmable I/O pin.
LDC
O
I/O
Low During Configuration (LDC) is driven Low until the I/O go active. It is available
as a control output indicating that configuration is not yet completed. After
configuration, LDC is a user-programmable I/O pin.
INIT
I/O
Before and during configuration, INIT is a bidirectional signal. A 1 k
Ω to 10 kΩ
external pull-up resistor is recommended.
As an active Low open-drain output, INIT is held Low during the power stabilization
and internal clearing of the configuration memory. As an active Low input, it can
be used to hold the FPGA in the internal WAIT state before the start of
configuration. Master mode devices stay in a WAIT state an additional 30 to
300
μs after INIT has gone High.
During configuration, a Low on this output indicates that a configuration data error
has occurred. After the I/O go active, INIT is a user-programmable I/O pin.
PGCK1 -
PGCK4
(Spartan)
Weak
Pull-up
I or I/O
Four Primary Global inputs each drive a dedicated internal global net with short
delay and minimal skew. If not used to drive a global buffer, any of these pins is a
user-programmable I/O.
The PGCK1-PGCK4 pins drive the four Primary Global Buffers. Any input pad
symbol connected directly to the input of a BUFGP symbol is automatically placed
on one of these pins.
Table 18: Pin Descriptions (Continued)
Pin Name
I/O
During
Config.
I/O After
Config.
Pin Description
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XCS203PQ208C0600 | 制造商:Xilinx 功能描述: |
| XCS20-3PQ208I | 功能描述:IC FPGA 5V I-TEMP 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan® 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS20-3PQ240C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XCS20-3PQ240I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL FPGA |
| XCS20-3PQ256C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
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