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参数资料
| 型号： | XP1003-BD-000V |
| 厂商： | MIMIX BROADBAND INC |
| 元件分类： | 放大器 |
| 英文描述： | 27000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | ROHS COMPLIANT, DIE-13 |
| 文件页数： | 3/6页 |
| 文件大小： | 560K |
| 代理商： | XP1003-BD-000V |
RF Out
RF In
Vd1,2
Vg1,2
VOUT1
VIN
VOUT2
Vd3,4
Vg3,4
Rin
1
2
3
4
5
6
7
8
10
9
13
12
11
1
2
3
4
5
2.500
(0.098)
1.757
(0.069)
0.677
(0.027)
0.0
0.765
(0.030)
2.157
(0.085)
3.400
(0.134)
6
7
8
1.357
(0.053)
0.957
(0.038)
1.757
(0.069)
1.357
(0.053)
0.957
(0.038)
10
9
13
12
11
2.957
(0.116)
2.557
(0.101)
2.157
(0.085)
2.757
(0.109)
27.0-35.0 GHz GaAs MMIC
Power Amplifier
Page 3 of 6
Mechanical Drawing
(Note: Engineering designator is 30H2BA0093)
Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold
All DC Bond Pads are 0.100 x 0.100 (0.004 x 0.004). All RF Pads are 0.100 x 0.200 (0.004 x 0.008).
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 5.253 mg.
Bias Arrangement
Bond Pad #1 (RF In)
Bond Pad #2 (Vg1)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg2)
Bond Pad #5 (Vd2)
Bond Pad #6 (VOUT1)
Bond Pad #7 (VIN)
Bond Pad #8 (VOUT2)
Bond Pad #9 (RF Out)
Bond Pad #10 (Vd4)
Bond Pad #11 (Vg4)
Bond Pad #12 (Vd3)
Bond Pad #13 (Vg3)
Bypass Capacitors - See App Note [3]
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2007 - Rev 02-Apr-07
P1003-BD
XP1003-BD
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| XP100400S-03 | 功能描述:以太网模块 XPORT-485 SAMPLE PACKAGE W/ CD RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
| XP100400S-03R | 功能描述:以太网模块 XPort RS485 Sample Package RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
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