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参数资料
| 型号： | XP1003-BD-000V |
| 厂商： | MIMIX BROADBAND INC |
| 元件分类： | 放大器 |
| 英文描述： | 27000 MHz - 35000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | ROHS COMPLIANT, DIE-13 |
| 文件页数： | 6/6页 |
| 文件大小： | 560K |
| 代理商： | XP1003-BD-000V |
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27.0-35.0 GHz GaAs MMIC
Power Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2007 - Rev 02-Apr-07
P1003-BD
Handling and Assembly Information
Ordering Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body
and the environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these
by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be discarded in
accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein:
(1) Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when properly used in accordance with instructions for use provided
in the labeling, can be reasonably expected to result in a significant injury to the user. (2) A critical component is any
component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the
life support device or system, or to affect its safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices
need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to
enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should
be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured
in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the
die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy
Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately
0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and
provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station
temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold
bond pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold
ribbon with 0.5-2% elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds
are acceptable for DC Bias connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended
though thermosonic bonding may be used providing the ultrasonic content of the bond is minimized. Bond force, time and
ultrasonics are all critical parameters. Bonds should be made from the bond pads on the die to the package or substrate. All
bonds should be as short as possible.
Part Number for Ordering
Description
XP1003-BD-000V
RoHS compliant die packed in vacuum release gel paks
XP1003-BD-EV1
XP1003-BD evaluation module
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XP1004000-03 | 功能描述:以太网模块 XPort-485 w/AES DISC-BY-MFG-05/07 RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
| XP1004000-03R | 功能描述:以太网模块 XPort RS485 Module Encryp./Ext. Temp. RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
| XP100400S-03 | 功能描述:以太网模块 XPORT-485 SAMPLE PACKAGE W/ CD RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
| XP100400S-03R | 功能描述:以太网模块 XPort RS485 Sample Package RoHS:否 制造商:Lantronix 产品:Device Servers 数据速率:300 bps to 921.6 kbps, 10 Mbps, 100 Mbps 接口类型:Ethernet, Serial 工作电源电压:5 V to 15 V 工作电源电流:133 mA to 400 mA 最大工作温度:+ 70 C |
| XP1005 | 制造商:MIMIX 制造商全称:MIMIX 功能描述:35.0-43.0 GHz GaAs MMIC Power Amplifier |
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