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参数资料
| 型号： | XP1012-BD-000W |
| 厂商： | MIMIX BROADBAND INC |
| 元件分类： | 放大器 |
| 英文描述： | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封装： | ROHS COMPLIANT, DIE-6 |
| 文件页数： | 6/6页 |
| 文件大小： | 159K |
| 代理商： | XP1012-BD-000W |
Velocium Products
18 - 20 GHz HPA
- APH478
Page 6 of 6
37.0-40.0 GHz GaAs MMIC
Power Amplifier
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Characteristic Data and Specifications are subject to change without notice.
2007 Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
April 2007 - Rev 19-Apr-07
P1012-BD
Handling and Assembly Information
Ordering Information
CAUTION! - Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
Do not ingest.
Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these
by-products are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this product.This product must be discarded in accordance
with methods specified by applicable hazardous waste procedures.
Life Support Policy - Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD - Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded anti-static workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to
enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should
be clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured
in a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the
die. An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy
Specifications for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately
0.0012 thick, placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and
provides scrubbing action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin
eutectic (80% Au 20% Sn) has a melting point of approximately 280 C (Note: Gold Germanium should be avoided). The work station
temperature should be 310 C +/- 10 C. Exposure to these extreme temperatures should be kept to minimum. The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding - Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
Part Number for Ordering
Description
XP1012-BD-000V
Where “V” is RoHS compliant die packed in vacuum release gel paks
XP1012-BD-000W
Where “W” is RoHS compliant die packed in waffle trays
XP1012-BD-EV1
XP1012 die evaluation module
相关PDF资料 |
PDF描述 |
|---|---|
| XR1005 | RF/MICROWAVE DOWN CONVERTER |
| XT38T32.768KHZE2 | QUARTZ CRYSTAL RESONATOR, 0.032768 MHz |
| XTL1021-1 | QUARTZ CRYSTAL RESONATOR, 16 MHz |
| XTL1022 | QUARTZ CRYSTAL RESONATOR, 24 MHz |
| XU1003-BD-000V | 19000 MHz - 26000 MHz RF/MICROWAVE UP CONVERTER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XP1013 | 制造商:MIMIX 制造商全称:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD | 制造商:MIMIX 制造商全称:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD-000V | 制造商:MIMIX 制造商全称:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-BD-EV1 | 制造商:MIMIX 制造商全称:MIMIX 功能描述:17.0-26.0 GHz GaAs MMIC Power Amplifier |
| XP1013-QD-0N00 | 制造商:M/A-COM Technology Solutions 功能描述:MMW DRIVER AMPLIFIER |
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