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| 型号： | XPC8240LVV200E |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 37/52页 |
| 文件大小： | 0K |
| 描述： | IC MPU INTEGRATED 200MHZ 352TBGA |
| 标准包装： | 24 |
| 系列： | MPC82xx |
| 处理器类型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 电压： | 2.5V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 352-LBGA |
| 供应商设备封装： | 352-TBGA（35x35） |
| 包装： | 托盘 |
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42
MPC8240 Integrated Processor Hardware Specifications
System Design Information
Tyco Electronics
800-522-6752
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
1.7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA, cavity-down, packaging technology shown
in Figure 26 are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 28 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 28. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this cavity-down, wire-bond TBGA package, heat generated on the active side of the chip is conducted
through the silicon, die attach, and package spreader, through the heat sink attach material (or thermal
interface material), and finally to the heat sink, where it is removed by forced-air convection.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize thermal
contact resistance. For those applications where the heat sink is attached by a spring clip mechanism,
Figure 29 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance.)
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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相关代理商/技术参数 |
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| XPC8240LZU200C | 制造商:Freescale Semiconductor 功能描述: |
| XPC8240LZU200E | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| XPC8240RVV250 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Modified voltage specifications to achieve 250 MHz |
| XPC8240RVV250E | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| XPC8240RZU250 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Modified voltage specifications to achieve 250 MHz |
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