参数资料
型号: XR16M554IJ-0B-EVB
厂商: Exar Corporation
文件页数: 44/46页
文件大小: 0K
描述: EVAL BOARD FOR XR16M554-B 68PLCC
标准包装: 1
系列: *
XR16M554/554D
7
REV. 1.0.0
1.62V TO 3.63V QUAD UART WITH 16-BYTE FIFO
CDA#
CDB#
CDC#
CDD#
-
64
18
31
49
9
27
43
61
19
42
59
2
I
UART channels A-D Carrier-Detect (active low) or gen-
eral purpose input. This input should be connected to
VCC when not used. This input has no effect on the
UART.
RIA#
RIB#
RIC#
RID#
-
63
19
30
50
8
28
42
62
18
43
58
3
I
UART channels A-D Ring-Indicator (active low) or gen-
eral purpose input. This input should be connected to
VCC when not used. This input has no effect on the
UART.
ANCILLARY SIGNALS
XTAL1
18
25
35
50
I
Crystal or external clock input.
XTAL2
19
26
36
51
O
Crystal or buffered clock output.
16/68#
14
-
31
-
I
Intel or Motorola Bus Select (input with internal pull-up).
When 16/68# pin is HIGH, 16 or Intel Mode, the device
will operate in the Intel bus type of interface.
When 16/68# pin is LOW, 68 or Motorola mode, the
device will operate in the Motorola bus type of interface.
Motorola bus interface is not available on the 64 pin
package.
RESET
(RESET#)
20
27
37
53
I
When 16/68# pin is HIGH for Intel bus interface, this
input becomes the Reset pin (active high). In this case,
a 40 ns minimum HIGH pulse on this pin will reset the
internal registers and all outputs. The UART transmitter
output will be held HIGH, the receiver input will be
ignored and outputs are reset during reset period
(Table 13). When 16/68# pin is at LOW for Motorola
bus interface, this input becomes Reset# pin (active
low). This pin functions similarly, but instead of a HIGH
pulse, a 40 ns minimum LOW pulse will reset the inter-
nal registers and outputs.
Motorola bus interface is not available on the 64 pin
package.
VCC
2, 24, 37
4, 21, 35,
52
13, 30,
47, 64
5, 25, 45,
65
Pwr
1.62V to 3.63V power supply.
GND
21, 47
14, 28,
45, 61
6, 23, 40,
57
16, 36,
56, 76
Pwr
Power supply common, ground.
GND
Center
Pad
N/A
Pwr
The center pad on the backside of the QFN package is
metallic and should be connected to GND on the PCB.
The thermal pad size on the PCB should be the approx-
imate size of this center pad and should be solder mask
defined. The solder mask opening should be at least
0.0025" inwards from the edge of the PCB thermal pad.
Pin Description
NAME
48-QFN
PIN #
64-LQFP
PIN #
68-PLCC
PIN#
80-LQFP
PIN #
TYPE
DESCRIPTION
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