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参数资料
| 型号： | 005-BT4-033-SNH-N |
| 元件分类： | 电源模块 |
| 英文描述： | 1-OUTPUT 33 W DC-DC REG PWR SUPPLY MODULE |
| 文件页数： | 13/16页 |
| 文件大小： | 266K |
| 代理商： | 005-BT4-033-SNH-N |
6
DC/DC Converter: 005-BT4-033-SNH-N
5V Input, 33W, +3.3V Output
Thermal Guidelines
Introduction
This DC/DC converter is designed using COB power
devices that are thermally coupled to a copper
based thermal carrier. The carrier acts as a heatsink
for all power devices and is cooled by conduction,
convection
and
radiation
to
the
surrounding
environment.
This converter will operate in natural and forced
convection environments. The supported reliability
level
is
dependent
upon
keeping
peak
case
temperatures below +75°C.
The Mean Time
Between Failures (MTBF) at 75°C is 3 million hours.
The thermal design data is provided to assist in
predicting chip operating temperatures in a variety of
environments.
The data presented was taken at the position on the
back side of the carrier as shown in Figure 3. This
location represents the area where the peak case
temperature occurs. All data shown is derived from
horizontally oriented cards with airflow parallel to the
shortest edge of the card (See Figure 3).
An
ambient temperature of +25°C was used for all
testing.
Natural/Forced Convection
Natural
convective
cooling
of
the
horizontally
mounted assembly is possible at the load conditions
indicated in Figure 2 on page 5.
Forced convection lowers the thermal resistance of
the metal substrate.
If the ambient temperature,
airflow at the DC/DC converter (in linear feet per
minute) and power usage are known, the thermal
performance of the assembly can be derived from
the curves in Figure 2 on page 5.
The converter has over temperature shutdown
protection.
The
over
temperature
circuit
will
shutdown
the
converter
when
the
backplane
temperature exceeds 145°C at the location shown in
Figure 3.
Backplane Temperature Measurement
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