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参数资料
| 型号： | 1490534-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 1/6页 |
| 文件大小： | 0K |
| 描述： | DIE ASSEMBLY AMPLI-BOND #8 |
| 标准包装： | 1 |
| 系列： | * |
| 配用： | A27320CT-ND - CONN RING 8 AWG #1/4 P-GRIP A100653TR-ND - TERMINAL RING TONGUE SZ 3/8 RED 696049-1-ND - TERM 8AWG RING #8 PG 52263-5-ND - TERM RING 8AWG #10 PLASTI-G 696050-2-ND - CONN RING TONGUE 8AWG #10 696050-1-ND - CONN RING TONG 8AWG #10 TIN 53944-1-ND - CONN RING TONG 8AWG #3/8 TIN A100818TR-ND - CONN RING TONGUE STRGHT 8AWG #8 A100646TR-ND - CONN RING TONGUE STR 8AWG #8 54725-1-ND - CONN RING TONGUE 8 AWG #1/4 TIN 更多... |
| 相关产品： | 1976230-1-ND - HYDRAULIC CRIMPING HEAD ASS Y 1490746-1-ND - TOOL 14 TON CRIMPING HEAD 1490749-1-ND - CRIMP TOOL HYDRAULIC |
Figure 1
This instruction sheet provides information on product
application and a maintenance and inspection
procedure for the crimping dies listed in Figure 1. The
dies are used in Hydraulic Crimping Head 1490746–1
and Hydraulic Hand Tool 1490749–1. For detailed
information on the crimping head and hand tool, refer
to the instructions packaged with these tools.
These dies are designed to crimp AMPLI–BOND and
PLASTI–GRIP terminals on wire sizes 8 to 2 AWG,
and Pre–Insulated AMPOWER terminals on wire size
2 AWG. Dies are coated with a preservative to
prevent rust and corrosion. Wipe preservative from
dies, particularly from crimping areas.
1. Refer to the chart in Figure 1 and verify that you
have the proper die set for the terminal and wire
size being used.
2. Before inserting dies in head, loosen socket
head cap screws holding insulation crimping
section of dies in place. See Figure 1. If screws are
not loosened, dies may not fit into head of tool
because of close tolerance.
3. Release the button and rock the die
back–and–forth until the nest snaps in place.
相关PDF资料 |
PDF描述 |
|---|---|
| ASG-C-X-B-19.440MHZ-T | OSC 19.440 MHZ 2.5V LVCMOS SMD |
| ASVMPC-12.352MHZ-LY-T3 | OSC 12.352 MHZ CMOS MEMS SMD |
| ASG-C-X-A-19.440MHZ-T | OSC 19.440 MHZ 3.3V LVCMOS SMD |
| ASVMPC-12.288MHZ-LY-T3 | OSC 12.288 MHZ CMOS MEMS SMD |
| ASVMPC-12.000MHZ-LY-T3 | OSC 12.000 MHZ CMOS MEMS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 1490535-1 | 功能描述:冲压机与冲模 AMPLI-BOND #6 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 1490536-1 | 功能描述:冲压机与冲模 AMPLI-BOND #4 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 149054 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM; Board Material:FR4 Epoxy Fibreglass; External Height:160mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes 制造商:Thomas & Betts 功能描述:PUSHROD KIT |
| 1490543-1 | 功能描述:PLATE, DIVIDER 制造商:te connectivity amp connectors 系列:* 零件状态:在售 标准包装:1 |
| 149055 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM; Board Material:FR4 Epoxy Fibreglass; External Height:220mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes |
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