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参数资料
| 型号： | 1490534-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | DIE ASSEMBLY AMPLI-BOND #8 |
| 标准包装： | 1 |
| 系列： | * |
| 配用： | A27320CT-ND - CONN RING 8 AWG #1/4 P-GRIP A100653TR-ND - TERMINAL RING TONGUE SZ 3/8 RED 696049-1-ND - TERM 8AWG RING #8 PG 52263-5-ND - TERM RING 8AWG #10 PLASTI-G 696050-2-ND - CONN RING TONGUE 8AWG #10 696050-1-ND - CONN RING TONG 8AWG #10 TIN 53944-1-ND - CONN RING TONG 8AWG #3/8 TIN A100818TR-ND - CONN RING TONGUE STRGHT 8AWG #8 A100646TR-ND - CONN RING TONGUE STR 8AWG #8 54725-1-ND - CONN RING TONGUE 8 AWG #1/4 TIN 更多... |
| 相关产品： | 1976230-1-ND - HYDRAULIC CRIMPING HEAD ASS Y 1490746-1-ND - TOOL 14 TON CRIMPING HEAD 1490749-1-ND - CRIMP TOOL HYDRAULIC |
1. Lift the upper release located in the C–head and
slide the anvil out of the head.
2. Activate the power unit until the lower die
release button located in the ram is exposed.
3. Depress the release button and slide the
indenter out of the ram.
1. Strip wire to dimensions listed in Figure 1. Do
Figure 2
4. Activate the power unit until the lower die
release button located in the ram is exposed.
5. Depress the release button and slide the
indenter into place.
6. Release the button and rock the indenter
back–and–forth until the die snaps in place.
7. Tighten the socket head cap screws holding the
insulation crimp section of dies.
8. Activate the power unit to allow ram to return to
the “down” position.
9. Lift the upper release located in the C–head and
slide the anvil into place.
Figure 3
NOT nick or cut conductor strands.
2. Insert stripped wire in terminal. End of wire must
be flush with or extend beyond edge of terminal
wire barrel.
3. Place terminal on dies. See Figure 3, Detail A.
Bottom of terminal tongue should face stationary
die and terminal wire barrel should rest against
spring–loaded locator.
4. Hold terminal in place and activate power unit to
complete crimp. Remove crimped terminal.
相关PDF资料 |
PDF描述 |
|---|---|
| ASG-C-X-B-19.440MHZ-T | OSC 19.440 MHZ 2.5V LVCMOS SMD |
| ASVMPC-12.352MHZ-LY-T3 | OSC 12.352 MHZ CMOS MEMS SMD |
| ASG-C-X-A-19.440MHZ-T | OSC 19.440 MHZ 3.3V LVCMOS SMD |
| ASVMPC-12.288MHZ-LY-T3 | OSC 12.288 MHZ CMOS MEMS SMD |
| ASVMPC-12.000MHZ-LY-T3 | OSC 12.000 MHZ CMOS MEMS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 1490535-1 | 功能描述:冲压机与冲模 AMPLI-BOND #6 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 1490536-1 | 功能描述:冲压机与冲模 AMPLI-BOND #4 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 149054 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM; Board Material:FR4 Epoxy Fibreglass; External Height:160mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes 制造商:Thomas & Betts 功能描述:PUSHROD KIT |
| 1490543-1 | 功能描述:PLATE, DIVIDER 制造商:te connectivity amp connectors 系列:* 零件状态:在售 标准包装:1 |
| 149055 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM; Board Material:FR4 Epoxy Fibreglass; External Height:220mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes |
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