- 您现在的位置：买卖IC网 > PDF目录18487 > 1490534-1 (TE Connectivity)DIE ASSEMBLY AMPLI-BOND #8 PDF资料下载
参数资料
| 型号： | 1490534-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 3/6页 |
| 文件大小： | 0K |
| 描述： | DIE ASSEMBLY AMPLI-BOND #8 |
| 标准包装： | 1 |
| 系列： | * |
| 配用： | A27320CT-ND - CONN RING 8 AWG #1/4 P-GRIP A100653TR-ND - TERMINAL RING TONGUE SZ 3/8 RED 696049-1-ND - TERM 8AWG RING #8 PG 52263-5-ND - TERM RING 8AWG #10 PLASTI-G 696050-2-ND - CONN RING TONGUE 8AWG #10 696050-1-ND - CONN RING TONG 8AWG #10 TIN 53944-1-ND - CONN RING TONG 8AWG #3/8 TIN A100818TR-ND - CONN RING TONGUE STRGHT 8AWG #8 A100646TR-ND - CONN RING TONGUE STR 8AWG #8 54725-1-ND - CONN RING TONGUE 8 AWG #1/4 TIN 更多... |
| 相关产品： | 1976230-1-ND - HYDRAULIC CRIMPING HEAD ASS Y 1490746-1-ND - TOOL 14 TON CRIMPING HEAD 1490749-1-ND - CRIMP TOOL HYDRAULIC |
11. Refer to Paragraph 3.4 and Figure 4 for crimp
inspection procedure.
This adjustment is made to both stationary and
moving dies after they have been placed in crimping
head.
Terminals and dies are color coded as listed and
shown in Figure 1. The dies have the terminal size
stamped in the wire barrel crimp sections of both the
moving and stationary dies. When crimped, the wire
size will appear on both sides of the terminal wire
1. The dies have three insulation crimp positions.
The adjustment is made by moving a pin–key (see
Figure 1). When the pin–key is pushed all the way
in, the insulation crimping section of the die is in
the loose position; when the pin–key is halfway
out, the insulation crimping section of the die is in
the medium position; when the pin–key is all the
way out, the insulation crimping section of the die
is in the tight position.
2. To adjust the insulation crimp, loosen socket
head cap screws and push pin–key all the way in
so that insulation crimp section of the die is in the
loose position.
3. Press and hold insulation die down against the
pin–key. This will prevent the spring–loaded
pin–key from popping back.
4. Tighten socket head cap screws.
5. Perform a test crimp (refer to Paragraph 3.1).
6. Remove crimped terminal from dies and visually
inspect the insulation crimp portion of terminal. The
insulation crimp should “grip” wire insulation (when
using AMPLI–BOND or AMPOWER terminals) or
provide “support” for wire insulation (when using
PLASTI–GRIP terminals).
7. If the insulation crimp does not grip or support
wire insulation as described in step 6, loosen
socket head cap screws and set the pin–keys in
the medium position. Then follow Steps 3 and 4.
8. Make another test crimp over previously
crimped terminal.
9. Remove crimped terminal from dies and visually
inspect insulation crimp.
10. Repeat adjustment as necessary until desired
insulation crimp is obtained. Do NOT use a tighter
setting than required.
barrel. The wire size appearing on the crimped wire
barrel should always agree with the wire size stamped
on the terminal tongue.
Inspect crimped terminals by checking the features
described in Figure 4.
Use only the terminals that meet the conditions
shown in the “ACCEPT” column. “REJECT” terminals
can be avoided through careful use of instructions in
Paragraphs 3.1 and 3.2, and by performing regular
die maintenance described in Section 4.
Regular inspections should be performed by quality
control personnel. A record of scheduled inspections
should remain with the dies and/or be supplied to the
supervisory personnel responsible for the dies.
Though recommendations call for at least one
inspection a month, the inspection frequency should
be based on the amount of use, ambient working
conditions, operator training and skill, and established
company standards. These inspections should be
performed in the following sequence:
Do not allow deposits of dirt, grease, or foreign matter
to accumulate in the die closure area, or on the
bottoming surfaces of the dies. These deposits may
prevent the dies from bottoming fully and may also
cause excessive wear in the die closure surfaces,
thereby affecting the quality of the crimp. The dies
should be wiped clean frequently with a clean cloth.
Visually inspect the die closure surfaces for flattened,
broken, pitted, or chipped conditions. Although dies
may gage within permissible limits, worn or damaged
die closure surfaces are objectionable and can affect
the quality of the crimp. Examples of possible
damaged die surfaces are shown in Figure 5.
相关PDF资料 |
PDF描述 |
|---|---|
| ASG-C-X-B-19.440MHZ-T | OSC 19.440 MHZ 2.5V LVCMOS SMD |
| ASVMPC-12.352MHZ-LY-T3 | OSC 12.352 MHZ CMOS MEMS SMD |
| ASG-C-X-A-19.440MHZ-T | OSC 19.440 MHZ 3.3V LVCMOS SMD |
| ASVMPC-12.288MHZ-LY-T3 | OSC 12.288 MHZ CMOS MEMS SMD |
| ASVMPC-12.000MHZ-LY-T3 | OSC 12.000 MHZ CMOS MEMS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 1490535-1 | 功能描述:冲压机与冲模 AMPLI-BOND #6 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 1490536-1 | 功能描述:冲压机与冲模 AMPLI-BOND #4 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 149054 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM; Board Material:FR4 Epoxy Fibreglass; External Height:160mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes 制造商:Thomas & Betts 功能描述:PUSHROD KIT |
| 1490543-1 | 功能描述:PLATE, DIVIDER 制造商:te connectivity amp connectors 系列:* 零件状态:在售 标准包装:1 |
| 149055 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM; Board Material:FR4 Epoxy Fibreglass; External Height:220mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes |
发布紧急采购，3分钟左右您将得到回复。