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| 型号： | 1490534-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 4/6页 |
| 文件大小： | 0K |
| 描述： | DIE ASSEMBLY AMPLI-BOND #8 |
| 标准包装： | 1 |
| 系列： | * |
| 配用： | A27320CT-ND - CONN RING 8 AWG #1/4 P-GRIP A100653TR-ND - TERMINAL RING TONGUE SZ 3/8 RED 696049-1-ND - TERM 8AWG RING #8 PG 52263-5-ND - TERM RING 8AWG #10 PLASTI-G 696050-2-ND - CONN RING TONGUE 8AWG #10 696050-1-ND - CONN RING TONG 8AWG #10 TIN 53944-1-ND - CONN RING TONG 8AWG #3/8 TIN A100818TR-ND - CONN RING TONGUE STRGHT 8AWG #8 A100646TR-ND - CONN RING TONGUE STR 8AWG #8 54725-1-ND - CONN RING TONGUE 8 AWG #1/4 TIN 更多... |
| 相关产品： | 1976230-1-ND - HYDRAULIC CRIMPING HEAD ASS Y 1490746-1-ND - TOOL 14 TON CRIMPING HEAD 1490749-1-ND - CRIMP TOOL HYDRAULIC |
Figure 4
3. Assemble stationary and moving dies so that
wire barrel dies are bottomed, but not under
pressure. See Figure 8.
4. With wire barrel dies bottomed, inspect the wire
barrel crimp die closure using the proper plug
gage. Hold gage in straight alignment with the die
closure and carefully try to insert, without forcing,
the GO element. See Figure 8, Detail A. The GO
element must pass completely through the wire
barrel crimp die closure.
5. Try to insert the NO–GO element. The NO–GO
element may enter partially, but must not pass
completely through the wire barrel die closure.
Figure 5
Every die set is inspected and tested for proper die
closure dimensions before packaging. An inspection
should be performed periodically to check the die
closure for excessive wear. A suggested gage design
and the GO and NO–GO dimensions of the plug gage
elements are shown in Figures 6 and 7. The following
procedure is recommended for inspecting the die set.
1. Clean oil or dirt from the bottoming surfaces, die
closure surfaces, and plug gage elements.
2. Remove two socket head cap screws and
locator from moving die. See Figure 8, Detail A.
This will provide access to the wire barrel dies for
plug gaging.
6. Re–install locator and secure with the two
socket head cap screws.
7. Loosen socket head cap screws from both
stationary and moving insulation dies and move
pin–keys all the way out so that insulation crimping
sections of dies are in the tight position. See
Figure 8, Detail B.
8. Press and hold insulation die down against
pin–key, and tighten the socket head cap screws.
9. With wire barrel dies bottomed, inspect the
insulation crimp die closure using the proper plug
gage in the same manner as steps 3 through 5.
See Figure 8, Detail B.
10. If both wire barrel and insulation die closures
meet the plug gage conditions, the dies are
considered to be dimensionally correct.
相关PDF资料 |
PDF描述 |
|---|---|
| ASG-C-X-B-19.440MHZ-T | OSC 19.440 MHZ 2.5V LVCMOS SMD |
| ASVMPC-12.352MHZ-LY-T3 | OSC 12.352 MHZ CMOS MEMS SMD |
| ASG-C-X-A-19.440MHZ-T | OSC 19.440 MHZ 3.3V LVCMOS SMD |
| ASVMPC-12.288MHZ-LY-T3 | OSC 12.288 MHZ CMOS MEMS SMD |
| ASVMPC-12.000MHZ-LY-T3 | OSC 12.000 MHZ CMOS MEMS SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 1490535-1 | 功能描述:冲压机与冲模 AMPLI-BOND #6 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 1490536-1 | 功能描述:冲压机与冲模 AMPLI-BOND #4 DIE ASSEMBLY RoHS:否 制造商:Souriau 大小: 产品:Dies 类型:Crimping 描述/功能: |
| 149054 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X160MM; Board Material:FR4 Epoxy Fibreglass; External Height:160mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes 制造商:Thomas & Betts 功能描述:PUSHROD KIT |
| 1490543-1 | 功能描述:PLATE, DIVIDER 制造商:te connectivity amp connectors 系列:* 零件状态:在售 标准包装:1 |
| 149055 | 制造商:KELAN 功能描述:PCB PLAIN S/S 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM 制造商:KELAN 功能描述:PCB, PLAIN, S/S, 100X220MM; Board Material:FR4 Epoxy Fibreglass; External Height:220mm; External Width:100mm; Board Thickness:1.6mm; SVHC:No SVHC (19-Dec-2012); Copper Coating Density:305 g/m sq; Copper Thickness:0.0356; External ;RoHS Compliant: Yes |
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