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参数资料
| 型号： | 18448 |
| 英文描述： | Microprocessor Family CPU Thermal Management Application Note? 126KB (PDF) |
| 中文描述： | 微处理器系列CPU散热管理应用笔记？ 126KB（PDF格式） |
| 文件页数： | 1/10页 |
| 文件大小： | 126K |
| 代理商： | 18448 |
Advanced
Micro
Devices
Application Note
CPU Thermal Management
OVERVIEW
Heat is generated by all semiconductors while operat-
ing. Most microprocessors to date have been able to
dissipate the heat directly to the ambient air without heat
sinks or fans. With faster processors that dissipate more
heat than the slower processors, it is no longer possible
to ignore thermal management. The objective is to en-
sure the generated heat is dissipated into the ambient
air while a safe operating temperature is maintained.
There are several methods for keeping the processor
cool. All of these methods include a combination of heat
sink and airflow. In general, the trade-off is heat sink
versus airflow. A smaller and less costly heat sink re-
quires more airflow. Analogously, larger heat sinks re-
quire less airflow to maintain a safe case temperature.
There are several choices of motherboards and com-
puter cases that manufacturers can use in their assem-
bly. After receiving the system, the end customer can
populate the system with a myriad of add-on cards and
peripherals; hence, it is extremely difficult to guarantee
that the processor will be adequately cooled in all the
different combinations of systems.
AMD has researched several products that aid in ther-
mal management design. The product that effectively
provides thermal management at a reasonable cost is
the heat sink and fan combination. This product consists
of a small fan mounted on a heat sink. The fan is pow-
ered by the standard power supply and connects via a
cable. The heat sink is clipped on or glued to the micro-
processor. The heat sink adds between 11/16" to 3/4"
of height to the processor. The space above the fan and
to the sides of the processor should be cleared to allow
for proper airflow. A typical heat sink and fan assembly
is shown in Figure 1.
AMD has tested various fan/heat sink devices and found
the Thermalloy 2321B-TCM cooling module to provide
reliable operation.
Figure 1. Heat Sink and Fan Assembly
HEAT SINKS AVAILABLE FOR Am486 AND
Am5X86 CPUs
Thermalloy’s Heat Sinks
Omnidirectional
Models: 2321B, 2332B, 2333B, 2342B
s 20% greater performance than extruded
equivalents
s Heat Sinks may be bonded to the PGA with epoxy
or with the PGA E-Z Mount frame (p/n 8317) and
spring (p/n PF17)
1 3/4"
Fan
Heat sink
1/4"
11/16"
1 3/4"
This application note describes CPU thermal management practices using a heat sink/fan combination. The heat
sink/fan assembly helps to guard against processor overheating in systems where the airflow may be restricted by
the addition of add-in cards or modules that can block airflow necessary for proper CPU cooling.
Publication#18448 Rev: D Amendment/0
Issue Date: August 1995
This document contains information on a product under development at Advanced Micro Devices. The information is
intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
相关PDF资料 |
PDF描述 |
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| 1845E | Optoelectronic |
| 1845G | Optoelectronic |
| 1845H | Optoelectronic |
| 1847E | Optoelectronic |
| 1847G | Optoelectronic |
相关代理商/技术参数 |
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| 1844800000 | 制造商:Weidmuller 功能描述:CONN TERM BLOCKS 27 POS 5.08MM SLDR ST TH 10A - Bulk 制造商:Weidmuller 功能描述:LP3R 5.08/27/90 3.2SN OR |
| 1844808 | 功能描述:20 位 端接块 接头，公引脚，带罩（4 面） 0.100"（2.54mm） 90°，直角 通孔 制造商:phoenix contact 系列:COMBICON DMC 包装:带卷（TR） 零件状态:新产品 类型:接头，公引脚，带罩（4 面） 针脚数:20 每级针脚数:10 级别数:2 间距:0.100"（2.54mm） 针座方向:90°，直角 插线入口:- 端子类型:焊接 安装类型:通孔 电流 - IEC:6A 电压 - IEC:160V 电流 - UL:6A 电压 - UL:150V 线规或范围 - AWG:- 线规或范围 -?mm2:- 颜色:黑 工作温度:- 触头配接表面处理:金 特性:固定焊尾 标准包装:300 |
| 1844810000 | 制造商:Weidmuller 功能描述:CONN TERM BLOCKS 33 POS 5.08MM SLDR ST TH 10A - Bulk 制造商:Weidmuller 功能描述:LP3R 5.08/33/90 3.2SN OR |
| 1844811 | 功能描述:22 位 端接块 接头，公引脚，带罩（4 面） 0.100"（2.54mm） 90°，直角 通孔 制造商:phoenix contact 系列:COMBICON DMC 包装:带卷（TR） 零件状态:新产品 类型:接头，公引脚，带罩（4 面） 针脚数:22 每级针脚数:11 级别数:2 间距:0.100"（2.54mm） 针座方向:90°，直角 插线入口:- 端子类型:焊接 安装类型:通孔 电流 - IEC:6A 电压 - IEC:160V 电流 - UL:6A 电压 - UL:150V 线规或范围 - AWG:- 线规或范围 -?mm2:- 颜色:黑 工作温度:- 触头配接表面处理:金 特性:固定焊尾 标准包装:300 |
| 1844820000 | 制造商:Weidmuller 功能描述:CONN TERM BLOCKS 36 POS 5.08MM SLDR ST TH 10A - Bulk 制造商:Weidmuller 功能描述:LP3R 5.08/36/90 3.2SN OR |
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