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| 型号： | 18448 |
| 英文描述： | Microprocessor Family CPU Thermal Management Application Note? 126KB (PDF) |
| 中文描述： | 微处理器系列CPU散热管理应用笔记？ 126KB（PDF格式） |
| 文件页数： | 5/10页 |
| 文件大小： | 126K |
| 代理商： | 18448 |
AMD
4
CPU Thermal Management
Figure 4. Heat Flow Path
Figure 5. Thermal Resistance Paths
(Schematic Representation)
Figure 6. Derating Curve
—
Heat Transfer
Any discussion of heat transfer should begin with a brief
overview of how heat is transferred. There are three
mechanisms by which heat may be transferred: convec-
tion, radiation, and conduction.
Convection involves the transfer of heat by the mixing
of fluid. It is the primary process for heat transfer from
a solid to a liquid or gas in contact with it. The rate of
convection heat flow is mainly a function of surface area,
position of the solid in contact with the fluid, the fluids
velocity and properties, and gravity force.
Thermal radiation is heat transferred by electromagnet-
ic radiation. It exists always, but is the only means of
heat transfer between entities separated by a vacuum.
Heat transfer by conduction involves the transfer of ki-
netic energy from one molecule to another. It is the pri-
mary mechanism for heat transfer between solids.
Conduction heat transfer is governed by Fourier’s law.
The thermal resistance equations, 1 and 1a, men-
tioned previously can be derived using Fourier’s law
stating that the rate of heat flow (P) through a material
is proportional to the cross sectional area (A) of the
material normal to the heat flow, the temperature gra-
dient (T) along the thickness (x) of the material, and
the thermal conductivity (K), a constant and a basic
property of the material. The value of K is in units
of W/
°C-cm mathematically:
expressed in units of W/cm2,
and hence:
Now look at the definition of heat capacity or the time
rate of heat flow.
Tj
ID
Ta
Tc
sa
θ
a. without heat sink
b. with heat sink
Heat sink
Insulator
...........................................
Tj
Tc
Ts
Ta
jc
θ
cs
θ
ja
θ
sa
θ
ca
θ
Tj = Junction Temperature
Tc = Case Temperature
Ts = Sink Temperature
Ta = Air Temperature
Without heat sink
With heat sink
θja = θjc + θca
θja = θjc + θcs + θja
Tc
Pmax
(500 mW)
TC0
TC1
TcM
100°C
125°C
200 mW
DF = Pmax
Tcm– Tc0
= 1
θ
jc
= 12 mW/ C
°
P
2
()
PKA
dT dx
()
kA x
()
T2
T1
–
()
=
=
3
()
T
θ P where
θ xKA
=
PdQ dt
=
APPENDIX
相关PDF资料 |
PDF描述 |
|---|---|
| 1845E | Optoelectronic |
| 1845G | Optoelectronic |
| 1845H | Optoelectronic |
| 1847E | Optoelectronic |
| 1847G | Optoelectronic |
相关代理商/技术参数 |
参数描述 |
|---|---|
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| 1844811 | 功能描述:22 位 端接块 接头，公引脚，带罩（4 面） 0.100"（2.54mm） 90°，直角 通孔 制造商:phoenix contact 系列:COMBICON DMC 包装:带卷（TR） 零件状态:新产品 类型:接头，公引脚，带罩（4 面） 针脚数:22 每级针脚数:11 级别数:2 间距:0.100"（2.54mm） 针座方向:90°，直角 插线入口:- 端子类型:焊接 安装类型:通孔 电流 - IEC:6A 电压 - IEC:160V 电流 - UL:6A 电压 - UL:150V 线规或范围 - AWG:- 线规或范围 -?mm2:- 颜色:黑 工作温度:- 触头配接表面处理:金 特性:固定焊尾 标准包装:300 |
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