参数资料
型号: 2SK4040-01
厂商: FUJI ELECTRIC CO LTD
元件分类: JFETs
英文描述: 17 A, 450 V, 0.38 ohm, N-CHANNEL, Si, POWER, MOSFET
封装: TFP, 4 PIN
文件页数: 2/19页
文件大小: 333K
代理商: 2SK4040-01
DW
G.
NO
.
H04-004-03
MS5F6073
10 / 19
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Fuji Electric Device Technology Co.,Ltd.
Before touching a MOSFET terminal, Discharge any static electricity from your body and clothes by
grounding out through a high impedance resistor (about 1M
)
When soldering, in order to protect the MOSFETs from static electricity, ground the soldering iron or
soldering bath through a low impedance resistor.
You must design the MOSFETs to be operated within the specified maximum ratings(voltage, current,
temperature, etc.) to prevent possible failure or destruction of devices.
Consider the possible temperature rise not only for the channel and case, but also for the outer leads.
Do not directly touch the leads or package of the MOSFETs while power is supplied or during operation
in order to avoid electric shock and burns.
The MOSFETs are made of incombustible material. However, if a MOSFET fails, it may emit smoke or
flame. Also, operating the MOSFETs near any flammable place or material may cause the MOSFETs to
emit smoke or flame in case the MOSFETs become even hotter during operation. Design the arrange-
ment to prevent the spread of fire.
The MOSFETs should not used in an environment in the presence of acid, organic matter, or corrosive
gas(hydrogen sulfide, sulfurous acid gas etc.)
The MOSFETs should not used in an irradiated environment since they are not radiation-proof.
Installation
Soldering involves temperatures which exceed the device storage temperature rating. To avoid device
damage and to ensure reliability, observe the following guidelines from the quality assurance standard.
Soldering methods
Methods
Packages
Wave
Soldering
(Full dipping)
Wave
Soldering
(Only terminal)
Infrared
Reflow
Air
Reflow
Soldering
iron
(Re-work)
T-Pack(S)
T-Pack(SJ)
K-Pack(S)
TFP
Possible
Limited to 1 time
Unable
Soldering temperature and duration
Reflow-Soldering
Number of times
Twice
Soldering Temp. &
Time
230
50sec
Package surface
Peak Temp. & Time
260
10sec
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相关代理商/技术参数
参数描述
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