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| 型号： | 440GRX |
| 厂商： | Applied Micro Circuits Corp. |
| 英文描述： | PowerPC 440GRx Embedded Processor |
| 中文描述： | 嵌入式处理器的PowerPC 440GRx |
| 文件页数： | 66/88页 |
| 文件大小： | 603K |
| 代理商： | 440GRX |
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440GRx – PPC440GRx Embedded Processor
Revision 1.08 – October 15, 2007
AMCC Proprietary
69
Preliminary Data Sheet
Thermal Management
The following heat sink was used in the above thermal analysis:
ALPHA LPD35-15B (35mm x 35mm x15mm)
The heat sink is manufactured by:
Alpha Novatech, Inc. (www.alphanovatech.com)
473 Sapena Court, #12
Santa Clara, CA 95054
Phone: 408-567-8082
Table 18. Package Thermal Specifications
Thermal resistance values for the TE-PBGA package in a convection environment at 6.3W are as follows:
Parameter
Symbol
Airflow
ft/min
(m/sec)
Unit
Notes
0
(0)
100
(0.51)
200
(1.02)
300
(1.53
400
(2.04)
500
(2.55)
Junction-to-ambient thermal resistance
without heat sink
θ
JA
13.1
11.7
10.9
10.5
10.3
10
°C/W
5
Junction-to-ambient thermal resistance
with heat sink
θ
JA
11.1
8.2
7.2
6.8
6.6
6.3
°C/W
5, 6
Resistance Value
Junction-to-case thermal resistance
θ
JC
3.5
°C/W
5
Junction-to-board thermal resistance
θ
JB
7.3
°C/W
5
Notes:
1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board.
2. TA = TC P×θCA, where TA is ambient temperature and P is power consumption.
3. TCMax = TJMax P×θJC, where TJMax is maximum junction temperature (+125°C) and P is power consumption.
4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes.
5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4
layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package).
6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a
0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK.
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