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参数资料
| 型号： | 543518-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 10/20页 |
| 文件大小： | 0K |
| 描述： | TOOL COVER TERMINATOR IDC AMPMOD |
| 标准包装： | 1 |
| 系列： | AMPMODU 50/50 栅格 |
| 压接手柄： | 91295-1 |
| 连接器类型： | 矩形 |
| 配用： | 5-104892-7-ND - CONN RECPT 70POS .050 W/ LATCH 5-104892-5-ND - CONN RECPT 50POS .050 W/ LATCH 5-104892-4-ND - CONN RECPT 40POS .050 W/ LATCH 5-104892-3-ND - CONN RECPT 30POS .050 W/ LATCH 5-104892-2-ND - CONN RECPT 20POS .050 W/ LATCH 6-104893-0-ND - CONN RECEPT 100POS .050 GOLD 5-104893-8-ND - CONN RECEPT 80POS .050 GOLD 5-104893-7-ND - CONN RECEPT 70POS .050 GOLD 5-104893-6-ND - CONN RECEPT 60POS .050 GOLD 5-104893-5-ND - CONN RECEPT 50POS .050 GOLD 更多... |
114- 7010
CAUTION
!
The vertical header and receptacle inherently function as a standoff; however, they must not be used as the only
standoff support between two pc boards.
3.9. Processing
The pc board pads must be solderable in accordance with Test Specification 109--11--1.
A. Typical Solder Paste Characteristics
1. Alloy type shall be either 63 Sn/37 Pb or 60 Sn/40 Pb.
2. Flux shall be RMA type.
3. Solids by weight shall be 85% minimum.
4. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).
5. Minimum viscosity of screen print shall be 5 x 10% cp (centipoise).
6. Minimum viscosity of stencil print shall be 7.5 x 10% cp (centipoise).
B. Solder Volume
Solder volume for each component shall be:
Receptacle . . . . . . . . . . . . . . . . . . . . . 0.17 mm 3 [.0000106 in. 3 ] per contact
Vertical Header . . . . . . . . . . . . . . . . . 0.71 mm 3 [.0000432 in. 3 ] per contact
Vertical Hold--down . . . . . . . . . . . . . . 1.34 mm 3 [.0000819 in. 3 ] per vertical header hold--down
Right--Angle Header . . . . . . . . . . . . . 0.22 mm 3 [.0000134 in. 3 ] per contact
Right--Angle Hold--Down Barb . . . . 1.50 mm 3 [.0000914 in. 3 ] per right--angle header hold--down
Right--Angle Hold--Down Pad . . . . . 2.41 mm 3 [.0001470 in. 3] per right--angle header hold--down
NOTE
Solder volume may vary depending on solder paste composition.
i
C. Stencil
Stencil aperture will be determined by the thickness of the stencil being used. Generally, the thinner
stencils will have a larger aperture to maintain a given volume of solder paste. Solder deposition should be
within the pad area of the contact solder tines. Typical aperture openings are provided in Figures 9, 10,
and 11.
CAUTION
!
CAUTION
!
NOTE
i
10 of 20
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
If a hold--down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
The recommended aperture width is 0.64 [.025] for the vertical receptacles and right--angle headers, and
0.69 [.027] for the vertical headers. It may be wider; however, care must be given to ensure against solder bridging
during processing.
Rev F
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