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参数资料
| 型号： | 543518-1 |
| 厂商： | TE Connectivity |
| 文件页数： | 3/20页 |
| 文件大小： | 0K |
| 描述： | TOOL COVER TERMINATOR IDC AMPMOD |
| 标准包装： | 1 |
| 系列： | AMPMODU 50/50 栅格 |
| 压接手柄： | 91295-1 |
| 连接器类型： | 矩形 |
| 配用： | 5-104892-7-ND - CONN RECPT 70POS .050 W/ LATCH 5-104892-5-ND - CONN RECPT 50POS .050 W/ LATCH 5-104892-4-ND - CONN RECPT 40POS .050 W/ LATCH 5-104892-3-ND - CONN RECPT 30POS .050 W/ LATCH 5-104892-2-ND - CONN RECPT 20POS .050 W/ LATCH 6-104893-0-ND - CONN RECEPT 100POS .050 GOLD 5-104893-8-ND - CONN RECEPT 80POS .050 GOLD 5-104893-7-ND - CONN RECEPT 70POS .050 GOLD 5-104893-6-ND - CONN RECEPT 60POS .050 GOLD 5-104893-5-ND - CONN RECEPT 50POS .050 GOLD 更多... |
114- 7010
B. Test Specifications
Test Specification 109--11 covers suggested test and evaluation methods.
C. Workmanship Specification
Workmanship Specification 101--21 provides requirements ands evaluation of solder fillets for surface
mounted connectors.
D. Commercial Specification
Commercial specification J--STD--001 provides solder joint requirements.
2.6. Instruction Material
The following Instruction Sheets (408) are available for tooling application and repair information for IDC
Connectors.
408--9817 -- Applicator Frame Assembly
408--9909 -- Cover Closing Tool
3. REQUIREMENTS
3.1. Material
The housings for all the connectors are made of glass--filled thermoplastic and the contacts of copper alloy, or
phosphor bronze nickel underplated with gold plated contact mating ends. Surface--mount solder tines are
tin--lead plated.
3.2. Storage
Connectors are packaged and shipped in antistatic tube containers. To prevent damage to the housings and
contacts, the connectors should remain in the container until ready for installation. Also, to prevent possible
storage contamination and insure maximum solderability for SMT solder tines, the connectors should be used
on a first in, first out basis.
3.3. Circuit Identification
The number 1 molded on the mating face of the housing provides circuit identification, and the number in the
rectangular block molded on the side of the vertical connector housing provides the stacking dimension (in
thousandths of an inch) between pc boards when two connectors are fully mated. See Figure 1.
3.4. Printed Circuit Boards for SMT Connectors
A. Tolerance
At the time of connector placement, the coplanarity of the pad pattern must be held to 0.05 [.002]
maximum. We recommend a solder mask to minimize solder bridging between pads. The mask must not
exceed the height of the pad by more than 0.05 [.002].
CAUTION
!
Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space
between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and
would not provide long term performance for the connector.
B. Material
The pc board material shall be glass epoxy (FR--4 or G--10) and should be 1.58 + 0.18 [.062 + .007] thick
to ensure proper performance of the connector hold--downs. Consult TE Engineering for suitability of other
materials, or other board thicknesses. A solder mask is recommended when soldering SMT connectors.
Those most suitable are Liquid Photo Imageable and Dry Film.
Rev F
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