参数资料
型号: 543518-1
厂商: TE Connectivity
文件页数: 14/20页
文件大小: 0K
描述: TOOL COVER TERMINATOR IDC AMPMOD
标准包装: 1
系列: AMPMODU 50/50 栅格
压接手柄: 91295-1
连接器类型: 矩形
配用: 5-104892-7-ND - CONN RECPT 70POS .050 W/ LATCH
5-104892-5-ND - CONN RECPT 50POS .050 W/ LATCH
5-104892-4-ND - CONN RECPT 40POS .050 W/ LATCH
5-104892-3-ND - CONN RECPT 30POS .050 W/ LATCH
5-104892-2-ND - CONN RECPT 20POS .050 W/ LATCH
6-104893-0-ND - CONN RECEPT 100POS .050 GOLD
5-104893-8-ND - CONN RECEPT 80POS .050 GOLD
5-104893-7-ND - CONN RECEPT 70POS .050 GOLD
5-104893-6-ND - CONN RECEPT 60POS .050 GOLD
5-104893-5-ND - CONN RECEPT 50POS .050 GOLD
更多...
114- 7010
F. Connector Placement
Connectors can be placed on the pc board by hand. When doing so, grip the connector at the ends of the
housing without touching the contact to prevent contamination and deformation of the solder tines. Vertical
connectors can be placed on the pc board with a hand loading tool. When using the tool, the connectors
should be emptied from the shipping tube into a feeder device and picked up with the tool as described in
the instructions packaged with the tool.
NOTE
i
Optimally, the connector solder tines should be aligned on the pc board pads. However, misregistration is permissible
for certain performance classifications as specified in J--STD--001. See Figure 12.
Connector
Solder Tine
PC Board Pad
PC Board
Tine Centered on PC
Board Pad is Preferable
Tine Overhang is
Acceptable for
Some Performance
Classifications Per
J-- STD-- 001
Figure 12
G. Solder
1. Parameters
The connectors will withstand temperatures of 260 _ C [500 _ F] for a maximum of three minutes. Higher
temperatures can be withstood for short periods of time as indicated in Figure 13 for the infrared (IR)
reflow. Refer to the recommendations provided in Figure 13 for typical reflow parameters. Due to the
many variables involved with the reflow process (ie, component density, orientation, etc), we
recommend that the user conduct trial runs under actual manufacturing conditions to ensure product
and process compatibility.
Preheat 350 _ C [662 _ F]
TOP HEATER
BOTTOM HEATER
ZONE 1
285 _ [545 _ ]
285 _ [545 _ ]
ZONE 2
265 _ [509 _ ]
265 _ [509 _ ]
ZONE 3
310 _ [590 _ ]
310 _ [590 _ ]
Figure 13
2. Process
We recommend that connectors be soldered using vapor phase (VPR), double sided non--focused
infrared (IR), or equivalent soldering technique. We have had success using Vitronics IR (Model
SMD 718) equipment.
Vitronics is a trademark.
14 of 20
Rev F
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