参数资料
型号: 7038BG
厂商: Aavid Thermalloy
文件页数: 61/116页
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
产品培训模块: How to Select a Heat Sink
标准包装: 2,000
类型: 插件板级
冷却式包装: Multiwatt,SIP
固定方法:
形状: 矩形
长度: 0.620"(15.75mm)
宽: 0.915"(23.24mm)
机座外的高度(散热片高度): 0.380"(9.65mm)
温升时的功耗: 1.5W @ 40°C
在强制气流下的热敏电阻: 在 600 LFM 时为6°C/W
自然环境下的热电阻: 16°C/W
材质:
材料表面处理: 黑色阳极化处理
其它名称: 032976
49
THRU
HOLE
DISCRETE
SEMIC
O
NDUCT
O
R
P
A
C
K
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
TO-220 Heat Sinks
ORDERING INFORMATION
5425
Space saving staggered fin heat sink
Space saving staggered fin heat
sink for vertical mounting TO-220
devices. Features integrated solderable
mounting tabs that can be twisted for
attachment to the PC board. Heat sink
is also available with tin plating for
soldering directly to the PC board.
22.22
(0.875)
10.67
(0.420)
1.57
(0.062)
17.78
(0.700)
6.35
(0.250)
19.56
(0.770)
31.75
(1.250)
3.96
(0.156)
THRU
3.17
(0.125)
8.89
(0.350)
1.27
(0.050)
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
22.20
(0.875)
3.17
(0.125)
THRU
31.75
(1.250)
19.56
(0.770)
6.35
(0.250)
1.91
(0.075)
2x
5.03
(0.198)
17.78
(0.700)
CL
Air Velocity—Feet Per Minute
Heat Dissipated—Watts
Thermal
Resistance
From
MTG
Surface
to
Ambient—
°
C/Watt
20
0
20
40
60
80
100
0
1
2
3
4
5
16
12
4
8
0
400
200
600
800
1000
Mounting
Surface
Temp
Rise
Above
Ambient—
°
C
Space savings twisted fin heat sink
for vertical mounting TO-220 devices.
Features staked on solderable mounting
tabs for easy attachment to the PC board.
5925
Space saving twisted fin heat sink
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
Material: 1.27 (0.050) Thick Aluminum
Finish: See Table
ORDERING INFORMATION
Part Number
Finish
592502B03400G
Black anodize
2.39 (0.094)
592502U03400G
Unfinished
2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
Part Number
Finish
542502B00000G
Black anodize
2.39 (0.094)
542502D00000G
Tin plated
2.39 (0.094)
Dia of PCB
Plated Thru
Hole for Tabs
For additional options see page 82
Grease
Epoxy
&
page112
Mounting
Kits
page 99
Grease
Epoxy
&
page112
Mounting
Kits
page 99
相关PDF资料
PDF描述
5767032-3 CONN PLUG 114POS VERT .025 SMD
5767017-3 CONN PLUG 114POS VERT .025 SMD
767057-4 CONN PLUG 152POS VERT .025 SMD
SOMC160310K0JEA RES ARRAY 10K OHM 8 RES 16-SOIC
767087-4 CONN PLUG 152POS VERT .025 SMD
相关代理商/技术参数
参数描述
7038L15PF 功能描述:静态随机存取存储器 RoHS:否 制造商:IDT 存储容量: 组织: 访问时间: 电源电压-最大: 电源电压-最小: 最大工作电流: 最大工作温度: 最小工作温度: 安装风格: 封装 / 箱体: 封装:
7038L15PF8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 15NS 100TQFP - Tape and Reel
7038L15PFG 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray
7038L15PFG8 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 15ns 100-Pin TQFP T/R 制造商:Integrated Device Technology Inc 功能描述:100 TQFP (PN100) - Tape and Reel
7038L20PF 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Async Dual 5V 1.125M-Bit 64K x 18 20ns 100-Pin TQFP Tray 制造商:Integrated Device Technology Inc 功能描述:SRAM ASYNC DUAL 5V 1.125MBIT 64KX18 20NS 100TQFP - Rail/Tube