- 您现在的位置：买卖IC网 > PDF目录294088 > 70V34S20PFGI (INTEGRATED DEVICE TECHNOLOGY INC) 4K X 18 DUAL-PORT SRAM, 20 ns, PQFP100 PDF资料下载
参数资料
| 型号： | 70V34S20PFGI |
| 厂商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分类： | SRAM |
| 英文描述： | 4K X 18 DUAL-PORT SRAM, 20 ns, PQFP100 |
| 封装： | 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100 |
| 文件页数： | 6/25页 |
| 文件大小： | 211K |
| 代理商： | 70V34S20PFGI |
6.42
IDT70V35/34S/L
(IDT70V25/24S/L)
High-Speed 3.3V 8/4K x 18 (8/4K x 16) Dual-Port Static RAM
Industrial and Commercial Temperature Ranges
14
Timing Waveform of Write Cycle No. 1, R/W Controlled Timing(1,5,8)
NOTES:
1. R/
W or CE or UB & LB must be HIGH during all address transitions.
2. A write occurs during the overlap (tEW or tWP) of a LOW
UB or LB and a LOW CE and a LOW R/W for memory array writing cycle.
3. tWR is measured from the earlier of
CE or R/W (or SEM or R/W) going HIGH to the end-of-write cycle.
4. During this period, the I/O pins are in the output state and input signals must not be applied.
5. If the
CE or SEM LOW transition occurs simultaneously with or after the R/W LOW transition the outputs remain in the HIGH-impedance state.
6. Timing depends on which enable signal is asserted last,
CE, R/W, or UB or LB.
7. This parameter is guaranteed by device characterization, but is not production tested. Transition is measured 0mV from steady state with Output Test Load
(Figure 2).
8. If
OE is LOW during R/W controlled write cycle, the write pulse width must be the larger of tWP or (tWZ + tDW) to allow the I/O drivers to turn off and data to be
placed on the bus for the required tDW. If
OE is HIGH during an R/W controlled write cycle, this requirement does not apply and the write pulse can be as short as
the specified tWP.
9. To access SRAM,
CE = VIL, UB or LB = VIL, and SEM = VIH. To access Semaphore, CE = VIH or UB and LB = VIH, and SEM = VIL. tEW must be met for either condition.
Timing Waveform of Write Cycle No. 2, CE, UB, LB Controlled Timing(1,5)
R/
W
tWC
tHZ
tAW
tWR
tAS
tWP
DATAOUT
(2)
tWZ
tDW
tDH
tOW
OE
ADDRESS
DATAIN
(6)
(4)
(7)
CE or SEM
5624 drw 09
(9)
CE or SEM
(9)
(7)
(3)
5624 drw 10
tWC
tAS
tWR
tDW
tDH
ADDRESS
DATAIN
R/
W
tAW
tEW
UB or LB
(3)
(2)
(6)
CE or SEM
(9)
相关PDF资料 |
PDF描述 |
|---|---|
| 710-405J12 | STEEL, CIRCULAR ADAPTER |
| 710-405J16 | STEEL, CIRCULAR ADAPTER |
| 710-405J24 | STEEL, CIRCULAR ADAPTER |
| 710-405J32 | STEEL, CIRCULAR ADAPTER |
| 710-405J40 | STEEL, CIRCULAR ADAPTER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 70V34S25PF | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| 70V34S25PF8 | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| 70V3569S4BC | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
| 70V3569S4BC8 | 制造商:Integrated Device Technology Inc 功能描述:SRAM Chip Sync Dual 3.3V 576K-Bit 16K x 36 4.2ns 256-Pin CABGA T/R 制造商:Integrated Device Technology Inc 功能描述:SRAM SYNC DUAL 3.3V 576KBIT 16KX36 4.2NS 256BGA - Tape and Reel |
| 70V3569S4BF | 功能描述:静态随机存取存储器 RoHS:否 制造商:Cypress Semiconductor 存储容量:16 Mbit 组织:1 M x 16 访问时间:55 ns 电源电压-最大:3.6 V 电源电压-最小:2.2 V 最大工作电流:22 uA 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:TSOP-48 封装:Tray |
发布紧急采购，3分钟左右您将得到回复。