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| 型号： | 73S8014RN-DB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 5/28页 |
| 文件大小： | 0K |
| 描述： | BOARD DEMO 73S8010RN 20-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
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DS_8014RN_014
73S8014RN Data Sheet
Rev. 1.0
13
3
Applications Information
This section provides general usage information for the design and implementation of the 73S8014RN. The
documents listed in Related Documentation provide more detailed information.
3.1
Example 73S8014RN Schematics
Figure 3 shows a typical application schematic for the implementation of the 73S8014RN.
Note that minor changes may occur to the reference material from time to time and the reader is encouraged to
contact Teridian for the latest information.
3.2
NDS Precautions
Preliminary testing against the NDS specification has found that the coupled noise level on the I/O signal may
approach the maximum NDS limits. Teridian recommends adding capacitor footprints on the CLK, RST and I/O
signals for addition of small capacitors to filter system noise if needed. These footprints should be added at or
near the smart card connector interface. A typical value of 27pF has been found to reduce the noise to
acceptable levels where the noise is an issue. In addition, Teridian recommends the addition of a 0 ohm series
resistor in the CLK path. If the CLK output is found to generate too much system noise, a small resistor can be
substituted to create a small RC network to slow the CLK edges and reduce the CLK noise to the rest of the
system. The amount of the noise being generated from the CLK signal depends on many factors including; board
layout and component placement, clock input source, distance between 8014 and the card interface, etc. Lastly,
some isolation between the CLK signal should be provided against all other system signals, especially the RST
and I/O signals.
相关PDF资料 |
PDF描述 |
|---|---|
| 73S8014R-DB | BOARD DEMO 73S8010R 20-SOIC |
| 73S8024RN-DB | BOARD DEMO 73S8024RN 28-SOIC |
| M3CKK-2018R | IDC CABLE - MKC20K/MC20M/MPK20K |
| M3AKK-2018R | IDC CABLE - MSC20K/MC20M/MPK20K |
| M3TTK-2618R | IDC CABLE - MSD26K/MC26M/MSD26K |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8014RN-IL/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface Comp w/8024 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-IL/F1 | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface Comp w/8024 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-IL/F2 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-IL/F3 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface Comp w/8024 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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