参数资料
型号: 74LVC1G57GF,132
厂商: NXP Semiconductors
文件页数: 9/15页
文件大小: 0K
描述: IC CONFIG MULTI-FUNC GATE 6XSON
产品培训模块: Logic Packages
特色产品: MicroPak?
标准包装: 5,000
系列: 74LVC
逻辑类型: 可配置多功能
电路数: 1
输入数: 3
施密特触发器输入:
输出类型: 单端
输出电流高,低: 32mA,32mA
电源电压: 1.65 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 6-XFDFN
供应商设备封装: 6-XSON,SOT891(1x1)
包装: 带卷 (TR)
其它名称: 568-9310-2
74LVC1G57GF,132-ND
74LVC1G57GF-H
74LVC1G57GF-H-ND
935282423132
74LVC1G57
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 6 — 6 December 2011
2 of 20
NXP Semiconductors
74LVC1G57
Low-power configurable multiple function gate
3.
Ordering information
4.
Marking
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5.
Functional diagram
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G57GW
40 Cto+125 C
SC-88
plastic surface-mounted package; 6 leads
SOT363
74LVC1G57GV
40 Cto+125 C
SC-74
plastic surface-mounted package; 6 leads
SOT457
74LVC1G57GM
40 Cto+125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
1.45 0.5 mm
SOT886
74LVC1G57GF
40 Cto+125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
1 0.5 mm
SOT891
74LVC1G57GN
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9
1.0 0.35 mm
SOT1115
74LVC1G57GS
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0
1.0 0.35 mm
SOT1202
Table 2.
Marking
Type number
Marking code[1]
74LVC1G57GW
YC
74LVC1G57GV
V57
74LVC1G57GM
YC
74LVC1G57GF
YC
74LVC1G57GN
YC
74LVC1G57GS
YC
Fig 1.
Logic symbol
Y
C
B
A
6
1
3
4
001aab583
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