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| 型号： | 87782-2001 |
| 厂商： | Molex Connector Corporation |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | CONN SOCKET MINIDIMM VERT SMD |
| 产品目录绘图： | 87782-2001 |
| 标准包装： | 1 |
| 系列： | 87782 |
| 连接器类型： | MiniDIMM |
| 位置数： | 244 |
| 存储器类型： | DDR 2 SDRAM |
| 标准： | MO-244 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨，锁存器 |
| 包装： | 托盘 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 30µin（0.76µm） |
| 产品目录页面： | 513 (CN2011-ZH PDF) |
| 其它名称： | 087782-2001 087782-2001-E 0877822001 0877822001-E 87782-2001-E 877822001 877822001-E WM23938 |
PRODUCT SPECIFICATION
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
The following documents are part of this specification between the requirements of this specified
herewith. In the event of conflict between the requirements of this specification and the product
drawings, the product drawings shall take precedence. In the event of conflict between the
requirements of this specification and reference documents, this specification shall take
precedence.
4.0 RATINGS
4.1 VOLTAGE
30 VRMS at 60 Hz
4.2 CURRENT
1.0 Amps at 30°C Temperature Rise
4.3 TEMPERATURE
Operating Temperature : -55°C to +85°C
Non Operating Temperature : -55°C to +85°C
5.0 PERFORMANCE
5.1 ELECTRICAL REQUIREMENTS
ITEM
DESCRIPTION
TEST CONDITION
REQUIREMENT
5.1.1
Contact
Resistance
Mate connectors: apply a maximum voltage of 30 m ? maximum (initial)
20mV and a current of 100mA 10 m ? maximum change
(Low Level)
Mated per EIA-364-23
from initial
5.1.2
Temperature Rise
at rated current
Temperature of mated connector at rated 1.0 Amps per contact at a
current for 96 hours (6 consecutive ckts link in maximum of 30 ° C
series.) temperature rise
5.1.3
Insulation
Resistance
Unmated per EIA-364-21
1000 Mega ? minimum
Dielectric
5.1.4
Withstanding
Unmated, 500VAC per EIA-364-20
No breakdown or flashover
Voltage
Risetime = 300pS (10% ~ 90%)
S:G ratio = 2:1
5.1.5
Time Domain
Impedance
Source imp
- 10%
Single-Ended Configuration
Test Procedure per EIA-364-108
Risetime = 300pS (10% ~ 90%)
S:G ratio = 2:1
5.1.6
Time Domain
Multiline Crosstalk
7nearest adjacent driven signal, 1 victim signal
Source impedance =
6% max (NEXT & FEXT)
Single-Ended Configuration
Test Procedure per EIA-364-90
REVISION: ECR/ECN INFORMATION: TITLE:
SHEET No.
B1
EC No:
DATE:
S2008-0204
2007/09/12
VERTICAL MINI DIMM CONNECTOR
200/244 CKT, 0.60MM PITCH
2 of 6
DOCUMENT NUMBER:
PS-87782-027
CREATED / REVISED BY:
ATSEE 2007/09/12
CHECKED BY:
SKANG 2007/09/20
APPROVED BY:
MLONG 2007/09/20
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 87782-2002 | 功能描述:DDR3 / DDR2 / DDR 连接器 0.60mm MiniDimm Assy Assy .76AuLF 244Ckt RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 877822003 | 制造商:Molex 功能描述:Conn Mini DIMM Socket SKT 244 POS 0.6mm Solder ST SMD Tray |
| 87782-2003 | 功能描述:DDR3 / DDR2 / DDR 连接器 0.60mm MiniDimm Assy Assy .76AuLF 244Ckt RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 87782-2004 | 功能描述:DDR3 / DDR2 / DDR 连接器 0.60mm MiniDimm Assy Assy .76AuLF 244Ckt RoHS:否 制造商:Molex 产品类型:DIMM 系列:78588 节距:1 mm 位置/触点数量:240 安装风格:Through Hole 安装角:Vertical 外壳材料:Thermoplastic 触点材料:Copper Alloy 触点电镀:Gold 电压额定值:29 V 电流额定值:1 A 长度: |
| 877822005 | 制造商:Molex 功能描述:Conn Mini DIMM Socket SKT 244 POS 0.6mm Solder ST SMD Tray |
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