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参数资料
| 型号： | 89HPES16T4G2 |
| 厂商： | Integrated Device Technology, Inc. |
| 英文描述： | 16-Lane 4-Port Gen2 PCI Express Switch |
| 中文描述： | 16巷4端口第二代的PCI Express开关 |
| 文件页数： | 15/32页 |
| 文件大小： | 305K |
| 代理商： | 89HPES16T4G2 |
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September 4, 2007
IDT 89HPES16T4G2 Data Sheet
A
Power Consumption
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 13
(and also listed below).
Maximumpower is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximumvoltages defined in
Table 13 (and also listed below).
T hermal Considerations
This section describes thermal considerations for the PES16T4G2 (23mm
2
SBGA288 package). The data in Table 16 below contains information
that is relevant to the thermal performance of the PES16T4G2 switch.
Note:
It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
J(max)
value
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
θ
JA
) for the worst case scenario must be
maintained below the value determned by the formula:
θ
JA
= (T
J(max)
- T
A(max)
)/P
Given that the values of T
J(max)
, T
A(max)
, and P are known, the value of desired
θ
JA
becomes a known entity to the systemdesigner. How to
achieve the desired
θ
JA
is left up to the board or systemdesigner, but in general, it can be achieved by adding the effects of
θ
JC
(value
provided in Table 16), thermal resistance of the chosen adhesive (
θ
CS
), that of the heat sink (
θ
SA
), amount of airflow and properties of the
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and systemdesign scenarios.
Number of ac tive
Lanes per Port
Core S upply
PCIe Analog
S upply
PCIe Analog
High S upply
PCIe Termin-
ation S upply
I/O S upply
Total
Typ
1.0V
Max
1.1V
Typ
1.0V
Max
1.1V
Typ
2.5V
Max
2.75V
Typ
1.0V
Max
1.1V
Typ
3.3V
Max
3.465V
Typ
Power
Max
Power
4/4/4/4
mA
852
1136
518
688
270
361
362
483
10
10
2.4W
3.5W
Watts
0.85
1.25
0.51
0.75
0.67
0.99
0.36
0.53
0.03
.034
4/4/1/1
mA
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Watts
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Table 15 PES16T4G2 Power Consumption
S ymbol
Parameter
Value
Units
Conditions
T
J(max)
T
A(max)
θ
JC
P
Junction Temperature
125
o
C
Maximum
Ambient Temperature
70
o
C
Maximum
Thermal Resistance, Junction-to-Case
1.1
o
C/W
Power Dissipation of the Device
3.5
Watts
Maximum
Table 16 Thermal Specifications for PES16T4G2, 23x23 mm SBGA288 Package
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 89HPES16T4G2ZABX | 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:16-Lane 4-Port Gen2 PCI Express Switch |
| 89HPES16T4G2ZABX8 | 功能描述:开关 IC - 各种 RoHS:否 制造商:Fairchild Semiconductor 开启电阻（最大值）: 电源电压-最大:4.4 V 电源电压-最小:2.5 V 最大工作温度:+ 85 C 最小工作温度:- 40 C 封装 / 箱体:WLCSP-9 封装:Reel |
| 89HPES16T4G2ZABXG | 功能描述:接口-I/O扩展器 RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| 89HPES16T4G2ZABXG8 | 功能描述:接口-I/O扩展器 RoHS:否 制造商:NXP Semiconductors 逻辑系列: 输入/输出端数量: 最大工作频率:100 kHz 工作电源电压:1.65 V to 5.5 V 工作温度范围:- 40 C to + 85 C 安装风格:SMD/SMT 封装 / 箱体:HVQFN-16 封装:Reel |
| 89HPES16T4G2ZBBX | 功能描述:Switch Interfacing Interface 288-SBGA (23x23) 制造商:idt, integrated device technology inc 系列:PRECISE?? 包装:托盘 零件状态:有效 应用:开关接口 接口:PCI Express 电压 - 电源:3.3V 封装/外壳:288-LBGA 供应商器件封装:288-SBGA（23x23） 安装类型:表面贴装 标准包装:60 |
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