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参数资料
| 型号： | 933741030163 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 二极管(射频、小信号、开关、功率) |
| 英文描述： | 0.7 A, 1000 V, SILICON, SIGNAL DIODE |
| 封装： | HERMETIC SEALED, GLASS PACKAGE-2 |
| 文件页数： | 7/12页 |
| 文件大小： | 71K |
| 代理商： | 933741030163 |
1996 Sep 18
4
Philips Semiconductors
Product specication
Fast soft-recovery
controlled avalanche rectiers
BYD33 series
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer
≥40 m, see Fig.19.
For more information please refer to the
“General Part of associated Handbook”.
maximum slope of reverse recovery
current
when switched from
IF = 1 A to VR ≥ 30 V
and dIF/dt = 1A/s;
see Fig.20
BYD33D to J
6A/
s
BYD33K to V
5A/
s
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-tp
thermal resistance from junction to tie-point
lead length = 10 mm
60
K/W
Rth j-a
thermal resistance from junction to ambient
note 1
120
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dI
R
dt
--------
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