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参数资料
型号： A3PE3000-1FG324
厂商： Microsemi SoC
文件页数： 1/162页
文件大小： 0K
描述： IC FPGA 1KB FLASH 3M 324-FBGA
标准包装： 84
系列： ProASIC3E
RAM 位总计： 516096
输入/输出数： 221
门数： 3000000
电源电压： 1.425 V ~ 1.575 V
安装类型： 表面贴装
工作温度： 0°C ~ 70°C
封装/外壳： 324-BGA
供应商设备封装： 324-FBGA（19x19）
January 2013
I
2013 Microsemi Corporation
ProASIC3E Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
High Capacity
600 k to 3 Million System Gates
108 to 504 kbits of True Dual-Port SRAM
Up to 620 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
Instant On Level 0 Support
Single-Chip Solution
Retains Programmed Design when Powered Off
On-Chip User Nonvolatile Memory
1 kbit of FlashROM with Synchronous Interfacing
High Performance
350 MHz System Performance
3.3 V, 66 MHz 64-Bit PCI
In-System Programming (ISP) and Security
ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
FlashLock Designed to Secure FPGA Contents
Low Power
Core Voltage for Low Power
Support for 1.5-V-Only Systems
Low-Impedance Flash Switches
High-Performance Routing Hierarchy
Segmented, Hierarchical Routing and Clock Structure
Ultra-Fast Local and Long-Line Network
Enhanced High-Speed, Very-Long-Line Network
High-Performance, Low-Skew Global Network
Architecture Supports Ultra-High Utilization
Pro (Professional) I/O
700 Mbps DDR, LVDS-Capable I/Os
1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
Bank-Selectable I/O Voltages—up to 8 Banks per Chip
Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS
2.5 V / 5.0 V Input
Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS
Voltage-Referenced I/O Standards: GTL+ 2.5 V / 3.3 V, GTL
2.5 V / 3.3 V, HSTL Class I and II, SSTL2 Class I and II, SSTL3
Class I and II
I/O Registers on Input, Output, and Enable Paths
Hot-Swappable and Cold Sparing I/Os
Programmable Output Slew Rate and Drive Strength
Programmable Input Delay
Schmitt Trigger Option on Single-Ended Inputs
Weak Pull-Up/-Down
IEEE 1149.1 (JTAG) Boundary Scan Test
Pin-Compatible Packages across the ProASIC3E Family
Clock Conditioning Circuit (CCC) and PLL
Six CCC Blocks, Each with an Integrated PLL
Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
Wide Input Frequency Range (1.5 MHz to 350 MHz)
SRAMs and FIFOs
Variable-Aspect-Ratio 4,608-Bit RAM Blocks (×1, ×2, ×4, ×9,
and ×18 organizations available)
True Dual-Port SRAM (except ×18)
24 SRAM and FIFO Configurations with Synchronous Operation
up to 350 MHz
ARM Processor Support in ProASIC3E FPGAs
M1 ProASIC3E Devices—Cortex-M1 Soft Processor Available
with or without Debug
Table 1-1 ProASIC3E Product Family
ProASIC3E Devices
A3PE600
A3PE1500
A3PE3000
Cortex-M1 Devices 1
M1A3PE1500
M1A3PE3000
System Gates
600,000
1,500,000
3,000,000
VersaTiles (D-flip-flops)
13,824
38,400
75,264
RAM Kbits (1,024 bits)
108
270
504
4,608-Bit Blocks
24
60
112
FlashROM Kbits
11
1
Secure (AES) ISP
Yes
CCCs with Integrated PLLs2
66
6
VersaNet Globals3
18
I/O Banks
88
8
Maximum User I/Os
270
444
620
Package Pins
PQFP
FBGA
PQ208
FG256, FG484
PQ208
FG484, FG676
PQ208
FG324
, FG484, FG896
Notes:
1. Refer to the Cortex-M1 product brief for more information.
2. The PQ208 package supports six CCCs and two PLLs.
3. Six chip (main) and three quadrant global networks are available.
4. For devices supporting lower densities, refer to the ProASIC3 Flash Family FPGAs datasheet.
Revision 13
相关PDF资料
PDF描述
A3PE3000L-FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
A3PE3000-1FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
A3PE3000L-FG324 IC FPGA 1KB FLASH 3M 324-FBGA
M1A3PE3000-1FG324 IC FPGA 1KB FLASH 3M 324-FBGA
M1A3PE3000-1FGG324 IC FPGA 1KB FLASH 3M 324-FBGA
相关代理商/技术参数
参数描述
A3PE3000-1FG324I 功能描述:IC FPGA 1KB FLASH 3M 324-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A3PE3000-1FG484 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
A3PE3000-1FG484I 功能描述:IC FPGA 1KB FLASH 3M 484-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP，带拉杆 供应商设备封装:352-CQFP（75x75）
A3PE3000-1FG896 功能描述:IC FPGA 1KB FLASH 3M 896-FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ProASIC3E 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA（23x23）
A3PE3000-1FG896ES 制造商:ACTEL 制造商全称:Actel Corporation 功能描述:ProASIC3E Flash Family FPGAs
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