参数资料
型号: A4447SLJTR-T
厂商: Allegro Microsystems Inc
文件页数: 10/12页
文件大小: 0K
描述: IC REG BUCK ADJ 2A 8SOIC
标准包装: 1
类型: 降压(降压)
输出类型: 可调式
输出数: 1
输出电压: 0.8 V ~ 24 V
输入电压: 8 V ~ 50 V
PWM 型: 电流模式
电流 - 输出: 2A
同步整流器:
工作温度: -20°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
包装: 标准包装
供应商设备封装: 8-SOIC-EP
产品目录页面: 1141 (CN2011-ZH PDF)
其它名称: 620-1329-6
A4447
High Voltage Step Down Regulator
Optimizing Thermal Layout
The features of the printed circuit board, including heat conduc-
tion and adjacent thermal sources such as other components,
have a very significant effect on the thermal performance of the
device. To optimize thermal performance, the following should
be taken into account:
? The device exposed thermal pad should be connected to as
much copper area as is available.
? Copper thickness should be as high as possible (for example,
2 oz. or greater for higher power applications).
? The greater the quantity of thermal vias, the better the dissipa-
tion. If the expense of vias is a concern, studies have shown
that concentrating the vias directly under the device in a tight
pattern, as shown in figure 6, has the greatest effect.
? Additional exposed copper area on the opposite side of the
board should be connected by means of the thermal vias. The
copper should cover as much area as possible.
? Other thermal sources should be placed as remote from the
device as possible
Signal traces
LJ package
footprint
0.7 mm
0.7 mm
LJ package
exposed
thermal pad
Top-layer
exposed copper
?0.3 mm via
Suggested PCB layout for thermal optimization (maximum
available bottom-layer copper recommended)
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10
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