参数资料
型号: A54SX16-CQ208B
厂商: Microsemi SoC
文件页数: 20/64页
文件大小: 0K
描述: IC FPGA SX 24K GATES 208-CQFP
标准包装: 1
系列: SX
LAB/CLB数: 1452
输入/输出数: 175
门数: 24000
电源电压: 3 V ~ 3.6 V,4.75 V ~ 5.25 V
安装类型: 表面贴装
封装/外壳: 208-BFCQFP,带拉杆
供应商设备封装: 208-CQFP(75x75)
SX Family FPGAs
v3.2
1-23
Register Cell Timing Characteristics
Timing Characteristics
Timing characteristics for SX devices fall into three
categories: family-dependent, device-dependent, and
design-dependent.
The
input
and
output
buffer
characteristics are common to all SX family members.
Internal routing delays are device-dependent. Design
dependency means actual delays are not determined
until after placement and routing of the user’s design is
complete. Delay values may then be determined by using
the DirectTime Analyzer utility or performing simulation
with post-layout delays.
Critical Nets and Typical Nets
Propagation delays are expressed only for typical nets,
which are used for initial design performance evaluation.
Critical net delays can then be applied to the most time-
critical paths. Critical nets are determined by net
property assignment prior to placement and routing. Up
to 6% of the nets in a design may be designated as
critical, while 90% of the nets in a design are typical.
Long Tracks
Some nets in the design use long tracks. Long tracks are
special routing resources that span multiple rows,
columns, or modules. Long tracks employ three and
sometimes five antifuse connections. This increases
capacitance and resistance, resulting in longer net delays
for macros connected to long tracks. Typically up to 6
percent of nets in a fully utilized device require long
tracks. Long tracks contribute approximately 4 ns to 8.4
ns delay. This additional delay is represented statistically
in higher fanout (FO = 24) routing delays in the
datasheet specifications section.
Timing Derating
SX devices are manufactured in a CMOS process.
Therefore, device performance varies according to
temperature, voltage, and process variations. Minimum
timing parameters reflect maximum operating voltage,
minimum
operating
temperature,
and
best-case
processing.
Maximum
timing
parameters
reflect
minimum
operating
voltage,
maximum
operating
temperature, and worst-case processing.
Figure 1-17 Flip-Flops
t
CLR
(positive edge triggered)
D
CLK
CLR
PRESET
Q
D
CLK
Q
CLR
PRESET
t
HPWH'
t
WASYN
t
HD
t
SUD
t
HP
t
HPWL
'
t
RCO
t
PRESET
RPWL
RPWH
相关PDF资料
PDF描述
EP4SGX110DF29C4 IC STRATIX IV FPGA 110K 780FBGA
93C56A-I/MS IC EEPROM 2KBIT 2MHZ 8MSOP
EP1S60F1020C6N IC STRATIX FPGA 60K LE 1020-FBGA
A54SX32A-1CQ256 IC FPGA SX 48K GATES 256-CQFP
93C56A-I/ST IC EEPROM 2KBIT 2MHZ 8TSSOP
相关代理商/技术参数
参数描述
A54SX16-CQ208M 功能描述:IC FPGA SX 24K GATES 208-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A54SX16-CQ256 功能描述:IC FPGA SX 24K GATES 256-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A54SX16-CQ256B 功能描述:IC FPGA SX 24K GATES 256-CQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:1 系列:ProASICPLUS LAB/CLB数:- 逻辑元件/单元数:- RAM 位总计:129024 输入/输出数:248 门数:600000 电源电压:2.3 V ~ 2.7 V 安装类型:表面贴装 工作温度:- 封装/外壳:352-BFCQFP,带拉杆 供应商设备封装:352-CQFP(75x75)
A54SX16P-1PQ208 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 标准包装:40 系列:SX-A LAB/CLB数:6036 逻辑元件/单元数:- RAM 位总计:- 输入/输出数:360 门数:108000 电源电压:2.25 V ~ 5.25 V 安装类型:表面贴装 工作温度:0°C ~ 70°C 封装/外壳:484-BGA 供应商设备封装:484-FPBGA(27X27)
A54SX16P-1PQ208I 功能描述:IC FPGA SX 24K GATES 208-PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:SX 产品培训模块:Three Reasons to Use FPGA's in Industrial Designs Cyclone IV FPGA Family Overview 特色产品:Cyclone? IV FPGAs 标准包装:60 系列:CYCLONE® IV GX LAB/CLB数:9360 逻辑元件/单元数:149760 RAM 位总计:6635520 输入/输出数:270 门数:- 电源电压:1.16 V ~ 1.24 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:484-BGA 供应商设备封装:484-FBGA(23x23)