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| 型号： | AD5273EVAL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 12/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR AD5273 |
| 标准包装： | 1 |
| 主要目的： | 数字电位器 |
| 已用 IC / 零件： | AD5273 |
| 已供物品： | 板 |
| 相关产品： | AD5273BRJZ10-R7DKR-ND - IC DGTL POT 64P 10K OTP SOT23-8 AD5273BRJZ50-REEL7TR-ND - IC POT DGTL 50K 64POS SOT23 AD5273BRJZ100-R7TR-ND - IC POT DGTL 1K 64POS SOT23 AD5273BRJZ1-REEL7TR-ND - IC POT DGTL 1K 64POS SOT23 AD5273BRJZ10-R7CT-ND - IC DGTL POT 64P 10K OTP SOT23-8 AD5273BRJZ10-R7TR-ND - IC DGTL POT 64P 10K OTP SOT23-8 AD5273BRJ10-R2CT-ND - IC DGTL POT 10K 64POS SOT23-8 AD5273BRJ1-R2CT-ND - IC DGTL POT 1K 64POS SOT23-8 AD5273BRJ100-R2CT-ND - IC DGTL POT 100K 64POS SOT23-8 AD5273BRJ50-R2CT-ND - IC DGTL POT 50K 64POS SOT23-8 |
AD5273
Rev. H | Page 2 of 24
TABLE OF CONTENTS
DAC.............................................................................................. 19
REVISION HISTORY
10/10—Rev. G to Rev. H
Changes to OTP Power Supply Parameter in Table 1.................. 4
Changes to VDD Pin Description in Table 3................................... 7
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section, Figure 38 .. 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
8/08—Rev. F to Rev. G
Changes to Power Supplies Parameter in Table 1......................... 3
Updated Fuse Blow Condition to 400 ms Throughout ............... 5
1/08—Rev. E to Rev. F
Changes to Table 1............................................................................ 4
Changes to Table 2............................................................................ 6
Changes to Table 3............................................................................ 7
Inserted Figure 28........................................................................... 12
Changes to One-Time Programming Section ............................ 13
Changes to Power Supply Considerations Section..................... 15
Deleted Figure 35............................................................................ 15
Changes to Figure 36...................................................................... 15
Updated Outline Dimensions ....................................................... 22
Changes to Ordering Guide .......................................................... 22
1/05—Rev. D to Rev. E
Changes to Features ..........................................................................1
Changes to Specifications.................................................................3
Changes to Table 3.............................................................................6
Changes to Power Supply Considerations Section .................... 15
Changes to Figure 35 and Figure 37............................................. 15
Changes to DAC Section ............................................................... 19
Changes to Level Shift for Different Voltages
Operation Section........................................................................... 20
Deleted the Resistance Scaling Section ....................................... 20
Deleted the Resolution Enhancement Section ........................... 20
12/04—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to Specifications.................................................................3
Changes to Theory of Operation Section.................................... 13
Changes to Power Supply Consideration
s Section.................... 15
Changes to Figure 35, Figure 36, and Figure 37 ......................... 15
11/03—Rev. B to Rev. C
Changes to SDA Bit Definitions and Descriptions .................... 10
Changes to One-Time Programming (OTP) Section................ 11
Changes to Table III ....................................................................... 11
Changes to Power Supply Considerations .................................. 13
Changes to Figure 8, Figure 9, and Figure 10 ............................. 13
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD5274 | 制造商:AD 制造商全称:Analog Devices 功能描述:1024-/256-Position, 1% Resistor Tolerance Error, I2C Interface and 50-TP Memory Digital Rheostat |
| AD5274BCPZ-100-RL7 | 功能描述:IC RHEOSTAT 5V 50-TP 256 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| AD5274BCPZ-20-RL7 | 功能描述:IC RHEOSTAT 5V 50-TP 256 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
| AD5274BRMZ-100 | 功能描述:IC RHEOSTAT 5V 50TP 256 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 接片:256 电阻（欧姆）:100k 电路数:1 温度系数:标准值 35 ppm/°C 存储器类型:非易失 接口:3 线串口 电源电压:2.7 V ~ 5.25 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WDFN 裸露焊盘 供应商设备封装:8-TDFN-EP（3x3） 包装:剪切带 (CT) 产品目录页面:1399 (CN2011-ZH PDF) 其它名称:MAX5423ETA+TCT |
| AD5274BRMZ-100-RL7 | 功能描述:IC RHEOSTAT 5V 50-TP 256 10MSOP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 数字电位器 系列:- 标准包装:3,000 系列:DPP 接片:32 电阻（欧姆）:10k 电路数:1 温度系数:标准值 300 ppm/°C 存储器类型:非易失 接口:3 线串行（芯片选择，递增，增/减） 电源电压:2.5 V ~ 6 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-WFDFN 裸露焊盘 供应商设备封装:8-TDFN（2x3） 包装:带卷 (TR) |
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