参数资料
型号: AD5310BRMZ-REEL7
厂商: Analog Devices Inc
文件页数: 7/16页
文件大小: 0K
描述: IC DAC 10BIT R-R W/BUFF 8-MSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1,000
设置时间: 6µs
位数: 10
数据接口: 串行
转换器数目: 1
电压电源: 单电源
功率耗散(最大): 1.25mW
工作温度: -40°C ~ 105°C
安装类型: 表面贴装
封装/外壳: 8-TSSOP,8-MSOP(0.118",3.00mm 宽)
供应商设备封装: 8-MSOP
包装: 带卷 (TR)
输出数目和类型: 1 电压,单极;1 电压,双极
采样率(每秒): 167k
Data Sheet
AD5310
Rev. B | Page 15 of 16
POWER SUPPLY BYPASSING AND GROUNDING
When accuracy is important in a circuit, it is helpful to carefully
consider the power supply and ground return layout on the board.
The printed circuit board containing the AD5310 should have
separate analog and digital sections, each having their own area
of the board. If the AD5310 is in a system where other devices
require an AGND to DGND connection, the connection should
be made at one point only. This ground point should be as close
as possible to the AD5310.
The power supply to the AD5310 should be bypassed with 10 F
and 0.1 F capacitors. The capacitors should be physically as
close as possible to the device, with the 0.1 F capacitor ideally
right up against the device. The 10 F capacitors are the tantalum
bead type. It is important that the 0.1 F capacitor has low effective
series resistance (ESR) and effective series inductance (ESI), such
as is the case with common ceramic types of capacitors. This
0.1 F capacitor provides a low impedance path to ground for
high frequencies caused by transient currents due to internal
logic switching.
The power supply line itself should have as large a trace as possible
to provide a low impedance path and to reduce glitch effects on
the supply line. Clocks and other fast switching digital signals
should be shielded from other parts of the board by digital
ground. Avoid crossover of digital and analog signals if possible.
When traces cross on opposite sides of the board, ensure that they
run at right angles to each other to reduce feedthrough effects
through the board. The best board layout technique is the micro-
strip technique, where the component side of the board is
dedicated to the ground plane only and the signal traces are
placed on the solder side. However, this is not always possible
with a 2-layer board.
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AD5310BRT-500RL7 功能描述:IC DAC 10BIT R-R W/BUFF SOT23-6 RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Data Converter Fundamentals DAC Architectures 设计资源:Unipolar, Precision DC Digital-to-Analog Conversion using AD5450/1/2/3 8-14-Bit DACs (CN0052) Precision, Bipolar, Configuration for AD5450/1/2/3 8-14bit Multiplying DACs (CN0053) AC Signal Processing Using AD5450/1/2/3 Current Output DACs (CN0054) Programmable Gain Element Using AD5450/1/2/3 Current Output DAC Family (CN0055) Single Supply Low Noise LED Current Source Driver Using a Current Output DAC in the Reverse Mode (CN0139) 标准包装:10,000 系列:- 设置时间:- 位数:12 数据接口:DSP,MICROWIRE?,QSPI?,串行,SPI? 转换器数目:1 电压电源:单电源 功率耗散(最大):- 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:SOT-23-8 薄型,TSOT-23-8 供应商设备封装:TSOT-23-8 包装:带卷 (TR) 输出数目和类型:1 电流,单极;1 电流,双极 采样率(每秒):2.7M
AD5310BRT-R2 功能描述:INTEGRATED CIRCUIT 制造商:analog devices inc. 系列:* 包装:带卷(TR) 零件状态:最後搶購 封装/外壳:SOT-23-6 供应商器件封装:SOT-23-6 标准包装:1
AD5310BRT-REEL 功能描述:IC DAC 10BIT R-R W/BUFF SOT23-6 RoHS:否 类别:集成电路 (IC) >> 数据采集 - 数模转换器 系列:- 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:50 系列:- 设置时间:4µs 位数:12 数据接口:串行 转换器数目:2 电压电源:单电源 功率耗散(最大):- 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-uMAX 包装:管件 输出数目和类型:2 电压,单极 采样率(每秒):* 产品目录页面:1398 (CN2011-ZH PDF)
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