参数资料
型号: AD5734RBREZ-REEL7
厂商: Analog Devices Inc
文件页数: 26/32页
文件大小: 0K
描述: IC DAC 14BIT DSP/SRL 24TSSOP
产品培训模块: Data Converter Fundamentals
DAC Architectures
设计资源: Software Configurable 14-Bit Quad-Channel Unipolar/Bipolar Voltage Output Using AD5734R (CN0084)
标准包装: 1,000
设置时间: 10µs
位数: 14
数据接口: DSP,MICROWIRE?,QSPI?,串行,SPI?
转换器数目: 4
电压电源: 双 ±
功率耗散(最大): 310mW
工作温度: -40°C ~ 80°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm)裸露焊盘
供应商设备封装: 24-TSSOP 裸露焊盘
包装: 带卷 (TR)
输出数目和类型: 4 电压,单极;4 电压,双极
采样率(每秒): 100k
AD5724R/AD5734R/AD5754R
Rev. E | Page 32 of 32
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MO-153-ADT
06
17
08
-A
24
13
12
1
6.40 BSC
0.15
0.05
0.10 COPLANARITY
TOP VIEW
EXPOSED
PAD
(Pins Up)
BOTTOM VIEW
4.50
4.40
4.30
7.90
7.80
7.70
1.20 MAX
1.05
1.00
0.80
0.65
BSC
0.30
0.19
SEATING
PLANE
0.20
0.09
0.75
0.60
0.45
5.02
5.00
4.95
3.25
3.20
3.15
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 51. 24-Lead Thin Shrink Small Outline Package, Exposed Pad [TSSOP_EP]
(RE-24)
Dimensions shown in millimeters
ORDERING GUIDE
Resolution
Temperature Range
INL
Package Description
Package Option
AD5724RBREZ
12
40°C to +85°C
±1 LSB
24-Lead TSSOP_EP
RE-24
AD5724RBREZ-REEL7
12
40°C to +85°C
±1 LSB
24-Lead TSSOP_EP
RE-24
AD5734RBREZ
14
40°C to +85°C
±4 LSB
24-Lead TSSOP_EP
RE-24
AD5734RBREZ-REEL7
14
40°C to +85°C
±4 LSB
24-Lead TSSOP_EP
RE-24
AD5754RBREZ
16
40°C to +85°C
±16 LSB
24-Lead TSSOP_EP
RE-24
AD5754RBREZ-REEL7
16
40°C to +85°C
±16 LSB
24-Lead TSSOP_EP
RE-24
EVAL-AD5754REBZ
Evaluation Board
1 Z = RoHS Compliant Part.
2009–2011 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06465-0-7/11(E)
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