参数资料
型号: AD8659ARZ
厂商: Analog Devices Inc
文件页数: 21/24页
文件大小: 0K
描述: IC OPAMP RRIO 18V CMOS 14SOIC
标准包装: 56
放大器类型: 通用
电路数: 4
输出类型: 满摆幅
转换速率: 0.07 V/µs
增益带宽积: 200kHz
电流 - 输入偏压: 5pA
电压 - 输入偏移: 350µV
电流 - 电源: 18µA
电流 - 输出 / 通道: 12mA
电压 - 电源,单路/双路(±): 2.7 V ~ 18 V,±1.35 V ~ 9 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 14-SOIC(0.154",3.90mm 宽)
供应商设备封装: 14-SO
包装: 管件
AD8657/AD8659
Data Sheet
Rev. B | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Rating
Supply Voltage
20.5 V
Input Voltage
(V) 300 mV to (V+) + 300 mV
Input Current1
±10 mA
Differential Input Voltage
±V
SY
Output Short-Circuit
Duration to GND
Indefinite
Temperature Ranges
Storage
65°C to +150°C
Operating
40°C to +125°C
Junction
65°C to +150°C
Lead Temperature
(Soldering, 60 sec)
300°C
1 The input pins have clamp diodes to the power supply pins. Limit the input
current to 10 mA or less whenever input signals exceed the power supply
rail by 0.3 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages using a
standard 4-layer JEDEC board. The exposed pad (LFCSP
packages only) is soldered to the board.
Table 6. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
8-Lead MSOP (RM-8)
142
45
°C/W
8-Lead LFCSP (CP-8-11)
75
12
°C/W
14-Lead SOIC (R-14)
115
36
°C/W
16-Lead LFCSP (CP-16-20)
52
13
°C/W
ESD CAUTION
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