- 您现在的位置：买卖IC网 > PDF目录10322 > AD9609BCPZRL7-20 (Analog Devices Inc)IC ADC 10BIT SPI/SRL 20M 32LFCSP PDF资料下载
参数资料
| 型号： | AD9609BCPZRL7-20 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 25/32页 |
| 文件大小： | 0K |
| 描述： | IC ADC 10BIT SPI/SRL 20M 32LFCSP |
| 标准包装： | 1,500 |
| 位数： | 10 |
| 采样率（每秒）： | 20M |
| 数据接口： | 串行，SPI? |
| 转换器数目： | 1 |
| 功率耗散（最大）： | 52mW |
| 电压电源： | 模拟和数字 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 32-LFCSP-VQ |
| 包装： | 带卷 (TR) |
| 输入数目和类型： | 2 个单端，单极；1 个差分，单极 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页当前第25页第26页第27页第28页第29页第30页第31页第32页
AD9609
Rev. 0 | Page 31 of 32
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting design and layout of the AD9609 as a system,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9609, it is strongly recom-
mended that two separate supplies be used. Use one 1.8 V supply
for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the
digital output supply (DRVDD). If a common 1.8 V AVDD and
DRVDD supply must be used, the AVDD and DRVDD domains
must be isolated with a ferrite bead or filter choke and separate
decoupling capacitors. Several different decoupling capacitors
can be used to cover both high and low frequencies. Locate
these capacitors close to the point of entry at the PCB level
and close to the pins of the part, with minimal trace length.
A single PCB ground plane should be sufficient when using the
AD9609. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
Exposed Paddle Thermal Heat Sink Recommendations
The exposed paddle (Pin 0) is the only ground connection for
the AD9609; therefore, it must be connected to analog ground
(AGND) on the customer’s PCB. To achieve the best electrical
and thermal performance, mate an exposed (no solder mask)
continuous copper plane on the PCB to the AD9609 exposed
paddle, Pin 0.
The copper plane should have several vias to achieve the
lowest possible resistive thermal path for heat dissipation to
flow through the bottom of the PCB. Fill or plug these vias
with nonconductive epoxy.
To maximize the coverage and adhesion between the ADC and
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP) at www.analog.com.
Encode Clock
For optimum dynamic performance a low jitter encode clock
source with a 50% duty cycle ±5% should be used to clock the
AD9609.
VCM
The VCM pin should be decoupled to ground with a 0.1 μF
capacitor, as shown in Figure 38.
RBIAS
The AD9609 requires that a 10 kΩ resistor be placed between
the RBIAS pin and ground. This resistor sets the master current
reference of the ADC core and should have at least a 1% tolerance.
Reference Decoupling
Externally decoupled the VREF pin to ground with a low ESR,
1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic
capacitor.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9609 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
相关PDF资料 |
PDF描述 |
|---|---|
| VE-B7K-MW-S | CONVERTER MOD DC/DC 40V 100W |
| VE-23P-IU-S | CONVERTER MOD DC/DC 13.8V 200W |
| VE-264-IU-S | CONVERTER MOD DC/DC 48V 200W |
| VE-B3H-IX-B1 | CONVERTER MOD DC/DC 52V 75W |
| D38999/24JD18PNLC | CONN HSG RCPT 18POS JAM NUT PINS |
相关代理商/技术参数 |
参数描述 |
|---|---|
| AD9609BCPZRL7-40 | 功能描述:IC ADC 10BIT SPI/SRL 40M 32LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:16 采样率（每秒）:45k 数据接口:串行 转换器数目:2 功率耗散（最大）:315mW 电压电源:模拟和数字 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC W 包装:带卷 (TR) 输入数目和类型:2 个单端，单极 |
| AD9609BCPZRL7-65 | 功能描述:IC ADC 10BIT SPI/SRL 65M 32LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:16 采样率（每秒）:45k 数据接口:串行 转换器数目:2 功率耗散（最大）:315mW 电压电源:模拟和数字 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC W 包装:带卷 (TR) 输入数目和类型:2 个单端，单极 |
| AD9609BCPZRL7-80 | 功能描述:IC ADC 10BIT SRL/SPI 80M 32LFCSP RoHS:是 类别:集成电路 (IC) >> 数据采集 - 模数转换器 系列:- 标准包装:1,000 系列:- 位数:16 采样率（每秒）:45k 数据接口:串行 转换器数目:2 功率耗散（最大）:315mW 电压电源:模拟和数字 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:28-SOIC（0.295"，7.50mm 宽） 供应商设备封装:28-SOIC W 包装:带卷 (TR) 输入数目和类型:2 个单端，单极 |
| AD9609XCPZ-40 | 功能描述:IC ADC 10BIT SPI/SRL 40M 制造商:analog devices inc. 系列:* 零件状态:上次购买时间 标准包装:1 |
| AD9609XCPZ-80 | 功能描述:IC ADC 10BIT SRL/SPI 80M 制造商:analog devices inc. 系列:* 零件状态:上次购买时间 标准包装:1 |
发布紧急采购，3分钟左右您将得到回复。