参数资料
型号: AD9785BSVZRL
厂商: Analog Devices Inc
文件页数: 59/64页
文件大小: 0K
描述: IC DAC 12BIT 800MSPS 100TQFP
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1,000
系列: TxDAC®
位数: 12
数据接口: 串行
转换器数目: 2
电压电源: 模拟和数字
功率耗散(最大): 450mW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 100-TQFP 裸露焊盘
供应商设备封装: 100-TQFP-EP(14x14)
包装: 带卷 (TR)
输出数目和类型: 2 电流,单极;2 电流,双极
采样率(每秒): 800M
AD9785/AD9787/AD9788
Rev. A | Page 62 of 64
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HDT
1
25
26
50
76
100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.27
0.22
0.17
0.50 BSC
1.05
1.00
0.95
0.15
0.05
0.75
0.60
0.45
SEATING
PLANE
1.20
MAX
1
25
26
50
76
100
75
51
6.50
NOM
3.5°
COPLANARITY
0.08
0.20
0.09
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
CONDUCTIVE
HEAT SINK
PIN 1
12
07
-A
NOTES:
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION
OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE,
WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
3. θJA: 27.4°C/W WITH THERMAL PAD UNSOLDERED, 19.1°C/W WITH THERMAL PAD SOLDERED TO PCB.
Figure 87. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
40
C to +85C
100-Lead TQFP_EP
SV-100-1
AD9785BSVZRL1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
40
C to +85C
100-Lead TQFP_EP
SV-100-1
Evaluation Board
Evaluation Board
Evaluation Board
1 RoHS Compliant Part.
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