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| 型号： | AD9912ABCPZ-REEL7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 17/40页 |
| 文件大小： | 0K |
| 描述： | IC DDS 1GSPS DAC 14BIT 64LFCSP |
| 产品培训模块： | Direct Digital Synthesis Tutorial Series (1 of 7): Introduction Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator |
| 标准包装： | 750 |
| 分辨率（位）： | 14 b |
| 主 fclk： | 1GHz |
| 调节字宽（位）： | 48 b |
| 电源电压： | 1.8V, 3.3V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 64-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 64-LFCSP-VQ（9x9） |
| 包装： | 带卷 (TR) |
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AD9912
Rev. F | Page 24 of 40
THERMAL PERFORMANCE
Table 7. Thermal Parameters
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Value
Unit
θJA
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
25.2
°C/W
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
22.0
°C/W
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
19.8
°C/W
θJB
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
13.9
°C/W
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.7
°C/W
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
0.1
°C/W
The AD9912 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ
= TCASE + (ΨJT × PD)
where:
TJ
is the junction temperature (°C).
TCASE
is the case temperature (°C) measured by customer at top
center of package.
ΨJT
is the value from Table 7.
PD
is the power dissipation (see the Total Power Dissipation
section in the Specifications section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ
= TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
The values in Table 7 apply to both 64-lead package options.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| AD9912BCPZ | 制造商:Analog Devices 功能描述:Direct Digital Synthesizer 1000MHz 1-DAC 14-Bit Serial 64-Pin LFCSP EP 制造商:Analog Devices 功能描述:DIRECT DGTL SYNTHESIZER 64LFCSP EP - Trays 制造商:Analog Devices 功能描述:IC DDS 1GSPS 14BIT DAC |
| AD9912BCPZ-REEL7 | 制造商:Analog Devices 功能描述:DIRECT DGTL SYNTHESIZER 64LFCSP EP - Tape and Reel |
| AD9913 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power 250 MSPS 10-Bit DAC 1.8 V CMOS Direct Digital Synthesizer |
| AD9913/PCBZ | 功能描述:数据转换 IC 开发工具 Sub 50mW 250MSPS (+) 10-bit DDS RoHS:否 制造商:Texas Instruments 产品:Demonstration Kits 类型:ADC 工具用于评估:ADS130E08 接口类型:SPI 工作电源电压:- 6 V to + 6 V |
| AD9913/PCBZ1 | 制造商:AD 制造商全称:Analog Devices 功能描述:Low Power 250 MSPS 10-Bit DAC 1.8 V CMOS Direct Digital Synthesizer |
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