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| 型号： | ADN8830ACPZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 22/22页 |
| 文件大小： | 0K |
| 描述： | IC CTRLR THERMO COOLER 32-LFCSP |
| 标准包装： | 1 |
| 应用： | 热电冷却器 |
| 电流 - 电源： | 8mA |
| 电源电压： | 3.3 V ~ 5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 供应商设备封装： | 32-LFCSP-VQ（5x5） |
| 包装： | 托盘 |
| 产品目录页面： | 789 (CN2011-ZH PDF) |
| 其它名称： | 015-0070 Q2376189 |
ADN8830
OUTLINE DIMENSIONS
5.10
5.00 SQ
0.30
0.25
PIN 1
4.90
0.18
INDICATOR
25
32
PIN 1
INDICATOR
0.50
BSC
24
17
EXPOSED
PAD
1
8
3.25
3.10 SQ
2.95
TOP VIEW
0.50
0.40
16
BOTTOM VIEW
9
0.25 MIN
0.80
0.30
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
0.08
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
Figure 26. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADN8830ACPZ
ADN8830ACPZ-REEL
ADN8830ACPZ-REEL7
1
Z = RoHS Compliant Part.
Temperature Range
?40°C to +85°C
?40°C to +85°C
?40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
Package Option
CP-32-7
CP-32-7
CP-32-7
REVISION HISTORY
3/12—Rev. C to Rev. D
Added EPAD Notation ..................................................................... 3
Updated Outline Dimensions ........................................................22
Changes to Ordering Guide ...........................................................22
11/03—Rev. B to Rev. C
Changes to Ordering Guide ............................................................. 3
Deleted Figure 24 ............................................................................21
Deleted Boosting the Output Voltage section .............................22
Deleted Figure 26 ............................................................................22
Deleted Equations 45, 46 and 47 ...................................................22
Updated Outline Dimensions ........................................................23
?2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D02793-0-3/12(B)
–22–
8/03—Rev. A to Rev. B
Updated Ordering Guide ................................................................. 3
Updated Thermal Setup Section ..................................................... 8
Updated Outline Dimensions........................................................ 23
2/03—Rev. 0 to Rev. A
Renumbered Figures .......................................................... Universal
Changes to Thermistor Setup Section ............................................ 8
Changes to Figure 14 ...................................................................... 15
Changes to Figure 23 ...................................................................... 20
Changes to Figure 25 ...................................................................... 21
Updated Outline Dimensions........................................................ 23
REV. D
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相关代理商/技术参数 |
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| ADN8830ACPZ-REEL | 功能描述:IC THERMO COOLER CNTRLR 32-LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 应用说明:Ultrasound Imaging Systems Application Note 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:37 系列:- 应用:医疗用超声波成像，声纳 电流 - 电源:- 电源电压:2.37 V ~ 6 V 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:56-WFQFN 裸露焊盘 供应商设备封装:56-TQFN-EP（8x8） 包装:管件 |
| ADN8830ACPZ-REEL7 | 功能描述:IC THERMO COOLER CTRLR 32-LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 电源管理 - 专用 系列:- 标准包装:1 系列:- 应用:手持/移动设备 电流 - 电源:- 电源电压:3 V ~ 5.5 V 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:14-WFDFN 裸露焊盘 供应商设备封装:14-LLP-EP（4x4） 包装:Digi-Reel® 配用:LP3905SD-30EV-ND - BOARD EVALUATION LP3905SD-30 其它名称:LP3905SD-30DKR |
| ADN8830XCP-REEL | 制造商:Analog Devices 功能描述:- Tape and Reel |
| ADN8831 | 制造商:AD 制造商全称:Analog Devices 功能描述:Thermoelectric Cooler (TEC) Controller |
| ADN8831ACP | 制造商:Analog Devices 功能描述:- Bulk |
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