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| 型号： | ADP1752ACPZ-1.8-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 15/20页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 1.8V .8A 16LFCSP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 1.8V |
| 输入电压： | 最高 3.6V |
| 电压 - 压降（标准）： | 0.07V @ 800mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 800mA（最小值） |
| 电流 - 限制（最小）： | 1A |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-VQFN 裸露焊盘，CSP |
| 供应商设备封装： | 16-LFCSP-VQ EP（4x4） |
| 包装： | 标准包装 |
| 其它名称： | ADP1752ACPZ-1.8-R7DKR |
Data Sheet
In this example, the worst-case temperature coefficient
(TEMPCO) over ?40°C to +85°C is assumed to be 15% for an
X5R dielectric. The tolerance of the capacitor (TOL) is assumed
Substituting these values in Equation 3 yields
C EFF = 4.46 μF × (1 ? 0.15) × (1 ? 0.1) = 3.41 μF
Therefore, the capacitor chosen in this example meets the
minimum capacitance requirement of the LDO over temper-
ature and tolerance at the chosen output voltage.
To guarantee the performance of the ADP1752 / ADP1753 , it is
imperative that the effects of dc bias, temperature, and toler-
ances on the behavior of the capacitors be evaluated for each
ADP1752/ADP1753
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of the
junction temperature stays below this maximum value, the user
needs to be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient tempera-
ture, power dissipation in the power device, and thermal resistance
between the junction and ambient air (θ JA ). The θ JA value is depen-
dent on the package assembly compounds used and the amount
of copper to which the GND pin and the exposed pad (EPAD)
of the package are soldered on the PCB. Table 6 shows typical
θ JA values for the 16-lead LFCSP for various PCB copper sizes.
application.
UNDERVOLTAGE LOCKOUT
The ADP1752 / ADP1753 have an internal undervoltage lockout
circuit that disables all inputs and the output when the input
voltage is less than approximately 1.58 V. This ensures that the
ble manner during power-up.
Table 6. Typical θ JA Values
Copper Size (mm 2 )
0 1
100
500
1000
6400
θ JA (°C/W), LFCSP
130
80
69
54
42
CURRENT-LIMIT AND THERMAL OVERLOAD
PROTECTION
1
Device soldered to minimum size pin traces.
The ADP1752 / ADP1753 are protected against damage due to
excessive power dissipation by current-limit and thermal
overload protection circuits. The ADP1752 / ADP1753 are
designed to reach current limit when the output load reaches
1.4 A (typical). When the output load exceeds 1.4 A, the output
Table 7. Typical Ψ JB Values
Copper Size (mm 2 )
100
500
1000
Ψ JB (°C/W) at 1 W
32.7
31.5
25.5
voltage is reduced to maintain a constant current limit.
Thermal overload protection is included, which limits the
The junction temperature of the ADP1752 / ADP1753 can be
calculated from the following equation:
junction temperature to a maximum of 150°C (typical). Under
extreme conditions (that is, high ambient temperature and
power dissipation) when the junction temperature begins to
rise above 150°C, the output is turned off, reducing the output
current to zero. When the junction temperature drops below
135°C (typical), the output is turned on again and the output
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
P D = [( V IN ? V OUT ) × I LOAD ] + ( V IN × I GND )
(4)
(5)
current is restored to its nominal value.
Consider the case where a hard short from VOUT to ground
occurs. At first, the ADP1752 / ADP1753 reach current limit so
that only 1.4 A is conducted into the short. If self-heating of
the junction becomes great enough to cause its temperature to
rise above 150°C, thermal shutdown activates, turning off the
output and reducing the output current to zero. As the junction
temperature cools and drops below 135°C, the output turns on
and conducts 1.4 A into the short, again causing the junction
temperature to rise above 150°C. This thermal oscillation between
135°C and 150°C causes a current oscillation between 1.4 A and
0 A that continues as long as the short remains at the output.
Current-limit and thermal overload protections are intended to
protect the device against accidental overload conditions. For
reliable operation, device power dissipation should be externally
limited so that junction temperatures do not exceed 125°C.
where:
V IN and V OUT are the input and output voltages, respectively.
I LOAD is the load current.
I GND is the ground current.
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation can
be simplified as follows:
T J = T A + {[( V IN ? V OUT ) × I LOAD ] × θ JA } (6)
As shown in Equation 6, for a given ambient temperature, input-
to-output voltage differential, and continuous load current, a
minimum copper size requirement exists for the PCB to ensure
through Figure 41 show junction temperature calculations for
different ambient temperatures, load currents, V IN to V OUT
differentials, and areas of PCB copper.
Rev. F | Page 15 of 20
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相关代理商/技术参数 |
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| ADP1752ACPZ-2.5-R7 | 功能描述:IC REG LDO 2.5V .8A 16LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:1 系列:- 稳压器拓扑结构:正，固定式 输出电压:3.3V 输入电压:2.5 V ~ 5.5 V 电压 - 压降（标准）:0.1V @ 200mA 稳压器数量:2 电流 - 输出:300mA 电流 - 限制（最小）:350mA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:8-UFQFN 供应商设备封装:8-MLPQ-UT（1.5x1.5） 包装:剪切带 (CT) 产品目录页面:1358 (CN2011-ZH PDF) 其它名称:SC560HULCT |
| ADP1752-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1752 - Boxed Product (Development Kits) |
| ADP1753ACPZ-R7 | 功能描述:IC REG LDO ADJ .8A 16LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - 线性 系列:- 标准包装:75 系列:- 稳压器拓扑结构:正，可调式 输出电压:1.2 V ~ 37 V 输入电压:4.2 V ~ 40 V 电压 - 压降（标准）:- 稳压器数量:1 电流 - 输出:500mA 电流 - 限制（最小）:500mA 工作温度:-40°C ~ 125°C 安装类型:表面贴装 封装/外壳:TO-252-3，DPak（2 引线+接片），SC-63 供应商设备封装:TO-252-3 包装:管件 产品目录页面:1286 (CN2011-ZH PDF) 其它名称:*LM317AMDT/NOPBLM317AMDT |
| ADP1753-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1753 - Boxed Product (Development Kits) |
| ADP1753-EVALZ | 制造商:AD 制造商全称:Analog Devices 功能描述:0.8 A, Low VIN, Low Dropout Linear Regulator |
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