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| 型号： | ADP1823-EVAL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 5/32页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADP1823 |
| 标准包装： | 1 |
| 主要目的： | DC/DC，步降 |
| 输出及类型： | 1，非隔离 |
| 输出电压： | 1.2V |
| 电流 - 输出： | 15A |
| 输入电压： | 5.5 ~ 20 V |
| 稳压器拓扑结构： | 降压 |
| 频率 - 开关： | 300kHz |
| 板类型： | 完全填充 |
| 已供物品： | 板 |
| 已用 IC / 零件： | ADP1823 |
| 产品目录页面： | 791 (CN2011-ZH PDF) |
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ADP1823
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, EN1, EN2
BST1, BST2
BST1, BST2 to SW1, SW2
CSL1, CSL2
SW1, SW2
DH1
DH2
DL1, DL2 to PGND
PGND to GND
LDOSD, SYNC, FREQ, COMP1,
COMP2, SS1, SS2, FB1, FB2, VREG,
PV, POK1, POK2, TRK1, TRK2
θ JA 4-Layer
(JEDEC Standard Board) 1, 2
Operating Ambient Temperature
Operating Junction Temperature 3
Storage Temperature Range
Rating
?0.3 V to +20 V
?0.3 V to +30 V
?0.3 V to +6 V
?1 V to +30 V
?2 V to +30 V
SW1 ? 0.3 V to BST1 + 0.3 V
SW2 ? 0.3 V to BST2 + 0.3 V
?0.3 V to PV + 0.3 V
±2 V
?0.3 V to +6 V
45°C/W
?40°C < T A < +85°C
?55°C < T J < +125°C
?65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
1
2
3
Measured with exposed pad attached to PCB.
Junction-to-ambient thermal resistance (θ JA ) of the package is based on
modeling and calculation using a 4-layer board. The junction-to-ambient
thermal resistance is application and board-layout dependent. In applications
where high maximum power dissipation exists, attention to thermal
dissipation issues in board design is required. For more information, refer
to Application Note AN-772, A Design and Manufacturing Guide for the Lead
Frame Chip Scale Package (LFCSP) .
In applications where high power dissipation and poor package thermal
resistance are present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T A_MAX ) is dependent on the
maximum operating junction temperature (T J_MAX_OP = 125 o C), the maximum
power dissipation of the device in the application (P D_MAX ), and the junction-
to-ambient thermal resistance of the part/package in the application (θ JA ),
and is given by: T A_MAX = T J_MAX_OP ? (θ JA × P D_MAX ).
Rev. D | Page 5 of 32
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