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参数资料
| 型号： | ADP225CP-EVALZ |
| 厂商： | Analog Devices Inc |
| 文件页数： | 21/24页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR ADP225 |
| 标准包装： | 1 |
| 系列： | * |
Data Sheet
ADP225 can be calculated by
140
120
ADP222/ADP223/ADP224/ADP225
T J = T A + ( P D × θ JA )
where:
T A is the ambient temperature.
P D is the power dissipation in the die, given by
(2)
100
80
60
P D = [( V IN ? V OUT ) × I LOAD ] + ( V IN × I GND )
where:
I LOAD is the load current.
I GND is the ground current.
V IN and V OUT are input and output voltages, respectively.
40
20
0
0
0.2
0.4
0.6
0.8
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
T J MAX
1.0
1.2
Power dissipation due to ground current is quite small and can
be ignored. Therefore, the junction temperature equation
simplifies to the following:
T J = T A + {[( V IN ? V OUT ) × I LOAD ] × θ JA }
As shown in the simplified equation, for a given ambient
temperature, input- to-output voltage differential, and continuous
load current, there exists a minimum copper size requirement
for the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 72 to Figure 75 show junction temperature
140
120
100
80
60
TOTAL POWER DISSIPATION (W)
Figure 73. 8-Lead LFCSP, T A = 50°C
calculations for different ambient temperatures, power dissipation,
and areas of PCB copper.
140
40
20
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
120
0
0
0.2
0.4
0.6
0.8
T J MAX
1.0
1.2
100
80
140
TOTAL POWER DISSIPATION (W)
Figure 74. 8-Lead LFCSP, T A = 85°C
60
40
20
6400mm 2
1000mm 2
500mm 2
100mm 2
25mm 2
JEDEC
T J MAX
120
100
80
0
0
0.2
0.4
0.6
0.8
1.0
1.2
60
TOTAL POWER DISSIPATION (W)
Figure 72. 8-Lead LFCSP, T A = 25°C
40
T B = 25°C
20
T B = 50°C
T B = 85°C
T J MAX
0
0
1
2
3
4
5
6
7
TOTAL POWER DISSIPATION (W)
Figure 75. 8-Lead LFCSP, T A = 85°C
In the case where the board temperature is known, use the
thermal characterization parameter, Ψ JB , to estimate the
junction temperature rise (see Figure 75). Maximum junction
temperature (T J ) is calculated from the board temperature (T B )
and power dissipation (P D ) using the following formula:
T J = T B + ( P D × Ψ JB )
(3)
The typical value of Ψ JB is 18.2°C/W for the 8-lead LFCSP package.
Rev. D | Page 21 of 24
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