参数资料
型号: ADP225CP-EVALZ
厂商: Analog Devices Inc
文件页数: 22/24页
文件大小: 0K
描述: BOARD EVAL FOR ADP225
标准包装: 1
系列: *
ADP222/ADP223/ADP224/ADP225
Data Sheet
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP222 / ADP223 / ADP224 / ADP225 . However, as listed in
TB2
TB1
J1
GND
R1 R2
TB5
Table 6, a point of diminishing returns is eventually reached
beyond which an increase in the copper size does not yield
significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUTx and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
U1 C2
TB3
C1
J2
C3
R4
R3
ADP223 - ________ - EVALZ
TB4
TB6
ANALOG
DEVICES
TB7
GND
Figure 76. Example 8-Lead LFCSP PCB Layout
Rev. D | Page 22 of 24
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